Pop package and method of fabricating the same

Abstract

A method of fabricating a package-on-package (POP) package is disclosed. The method includes preparing a first semiconductor package including a first substrate having external contact electrodes and a first semiconductor chip mounted on the first substrate, and preparing a second semiconductor package including a second substrate having external contact electrodes and a second semiconductor chip mounted on the second substrate. The method further includes forming lead lines in the second semiconductor package, the lead lines being electrically connected to the external contact electrodes of the second substrate, and stacking the second semiconductor package on the first semiconductor package and electrically connecting the external contact electrodes of the first substrate to the external contact electrodes of the second substrate using the lead lines.

1 . A method of fabricating a package-on-package (POP) package, the method comprising:
 preparing a first semiconductor package including a first substrate having external contact electrodes and a first semiconductor chip mounted on the first substrate;   preparing a second semiconductor package including a second substrate having external contact electrodes and a second semiconductor chip mounted on the second substrate;   forming lead lines in the second semiconductor package, the lead lines being electrically connected to the external contact electrodes of the second substrate; and   stacking the second semiconductor package on the first semiconductor package and electrically connecting the external contact electrodes of the first substrate to the external contact electrodes of the second substrate using the lead lines.   
     
     
         2 . The method of  claim 1 , wherein the forming of lead lines in the second semiconductor package comprises:
 bonding the second semiconductor package to a lead frame, the lead frame including a plurality of lead lines corresponding to the external contact electrodes of the second semiconductor package;   separating the lead lines from the lead frame; and   bending the lead lines toward the first semiconductor package when the first semiconductor package and the second semiconductor package are stacked.   
     
     
         3 . The method of  claim 2 , wherein bending the lead lines comprises bending the lead lines so as to form an angle of about 90° to about 120°. 
     
     
         4 . The method of  claim 2 , wherein the preparing of a second semiconductor package comprises forming the external contact electrodes of the second substrate in two lines along the outer perimeter of the second substrate on a lower surface thereof,
 the external contact electrodes comprise outer external contact electrodes and inner external contact electrodes,   the outer external contact electrodes are defined as first external contact electrodes and the inner external contact electrodes are defined as second external contact electrodes,   the lead frame comprises:
 a lead frame support and a punched portion formed therein; 
 a pad located at a center of the punched portion; 
 a bridge for connecting the pad to the lead frame support and supporting the pad; 
 first lead lines formed along an inner perimeter of the punched portion and corresponding to the first external contact electrodes; and 
 second lead lines formed along an outer perimeter of the pad and corresponding to the second external contact electrodes; and 
 the separating of the lead lines from the lead frame comprises: 
 cutting an end portion of the first lead lines directed outside the second semiconductor package; and 
 cutting an end portion of the second lead lines directed inside the second semiconductor package. 
   
     
     
         5 . The method of  claim 2 , wherein the preparing of a second semiconductor package comprises forming the external contact electrodes of the second substrate in two lines along the outer perimeter of the second substrate on the lower surface thereof, with outer external contact electrodes and inner external contact electrodes in the two lines arranged in a zigzag pattern. 
     
     
         6 . The method of  claim 5 , wherein the lead frame comprises:
 a lead frame support and a punched portion formed therein;   first lead lines corresponding to the outer external contact electrodes; and   second lead lines corresponding to the inner external contact electrodes and having a length greater than that of the first lead lines, wherein the first lead lines and the second lead lines are alternately repeated and formed along an inner perimeter of the punched portion.   
     
     
         7 . The method of  claim 2 , wherein the bonding of the second semiconductor package to a lead frame is performed using a conductive resin, conductive tape, or solder. 
     
     
         8 . The method of  claim 1 , wherein the external contact electrodes of the first substrate are in the form of holes passing through the first substrate, and
 electrically connecting the external contact electrodes of the first substrate to the external contact electrodes of the second substrate using the lead lines comprises passing the lead lines through the external contact electrodes of the first substrate and connecting the lead lines to an external board on which the POP package is mounted.   
     
     
         9 . The method of  claim 8 , wherein the end of each lead line passing through the external contact electrode of the first substrate is in a gull-wing form, a J form, or a standing form. 
     
     
         10 . The method of  claim 1 , further comprising forming solder balls on the external contact electrodes of the first semiconductor package to connect the POP package with an external board.