Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures

Abstract

In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

1 . An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
 (A) depositing at least a portion of a layer onto the substrate, wherein the substrate may comprise previously deposited material; and   (B) forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously deposited layer;   wherein the layers comprise at least three different materials and wherein the layers contain patterns of material comprising:
 (1) a desired structural component that is to be protected and that is formed from at least one structural material; 
 (2) a protective enclosure that is formed at least in part from a structural material, wherein at least one portion of the enclosure at least partially surrounds the desired structural component, and wherein the enclosure is limited by at least one opening therein; 
 (3) a sealing material located near the at least one opening; and 
 (4) a sacrificial material located at least partially between the desired structural component to be protected and at least a portion of the enclosure; 
   wherein after formation of the layers at least portion of the sacrificial material located between the desired structural component and at least a portion of the enclosure is removed; and   wherein after the removal of the sacrificial material, the sealing material is made to temporarily flow and seal at least one opening to block or significantly limit a passage of material from an outside of the enclosure to an inside of the enclosure via the at least one sealed opening, and   wherein the enclosure includes an electrical feed through;   
   
   
       2 . The process of  claim 1  wherein the enclosure includes a lid that includes the electrical feed through. 
   
   
       3 . The process of  claim 2  wherein an electrical connection is made from the electrical feed through to at least a portion of the desired structural component. 
   
   
       4 . The process of  claim 3  wherein the electrical connection includes a compliant element for making a pressure connection. 
   
   
       5 . The process of  claim 1  wherein the enclosure includes a portion that has a thickness no greater than a thickness of a single layer from which the enclosure is formed and wherein the portion is formed from at least two deposited layers of material. 
   
   
       6 . The process of  claim 5  wherein a planarization operation is used in forming each of at least two of the deposited layers that form the portion. 
   
   
       7 . The process of  claim 1  wherein the removal of the sacrificial material comprises etching. 
   
   
       8 . The process of  claim 1  wherein after removal and prior to sealing, a reducing agent is provided at least one location within or near the at least one opening to reduce the presence of any oxides at the at least one location. 
   
   
       9 . The process of  claim 1  wherein after removal and prior to sealing, a desired fill gas is made to fill an interior cavity of the enclosure in which the desired structural component is at least partially located. 
   
   
       10 . The process of  claim 1  wherein after removal and prior to sealing, an interior cavity of the enclosure in which the desired structural component is at least partially located is at least partially evacuated. 
   
   
       11 . The process of  claim 1  wherein at least one opening and the sealing material are so located that the sealing material need not flow over any structural material when flowing to seal the opening. 
   
   
       12 . The process of  claim 1  wherein at least one opening is sealed at least in part by the surface tension of the flowable sealing material causing the sealing material to bulge and bridge the opening. 
   
   
       13 . The process of  claim 1  wherein at least one opening has sloped walls that give the opening a non-fixed cross-sectional dimension through the enclosure, the sealing material, or a combination of the sealing material and the enclosure. 
   
   
       14 . The process of  claim 1  wherein at least one opening has a restriction around which sealing material will flow when sealing the opening. 
   
   
       15 . An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
 (A) depositing at least a portion of a layer onto a substrate, wherein the substrate may comprise previously deposited material; and   (B) forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously deposited layer   wherein the layers comprise at least two different materials and wherein the layers contain patterns of material comprising:
 (1) a desired structural component that is to be protected and that is formed from at least one structural material; 
 (2) a protective enclosure that is formed at least in part from a structural material, wherein at least one portion of the enclosure at least partially surrounds the desired structural component, and wherein the enclosure is limited by at least one opening therein; 
 (3) a sacrificial material located at least partially between the desired structural component to be protected and at least a portion of the enclosure; 
   wherein after formation of the layers at least portion of the sacrificial material located between the desired structural component and at least a portion of the enclosure is removed,   wherein after the removal of the sacrificial material, a seal is formed between the protective enclosure and a sealing structure wherein at least one of the protective enclosure or sealing structure comprises a sealing material that may be used in establishing a sealing of the at least one opening to block or significantly limit a passage of material from an outside of the enclosure to an inside of the enclosure via the at least one sealed opening, and   wherein the enclosure includes an electrical feed through.   
   
   
       16 . The process of  claim 15  wherein the enclosure includes a lid that includes the electrical feed through. 
   
   
       17 . The process of  claim 16  wherein an electrical connection is made from the electrical feed through to at least a portion of the desired structural component. 
   
   
       18 . The process of  claim 17  wherein the electrical connection includes a compliant element for making a pressure connection. 
   
   
       19 . The process of  claim 15  wherein the enclosure includes a portion that has a thickness no greater than a thickness of a single layer from which the enclosure is formed and wherein the portion is formed from at least two deposited layers of material. 
   
   
       20 . The process of  claim 19  wherein a planarization operation is used in forming each of at least two of the deposited layers that form the portion. 
   
   
       21 . An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
 (C) depositing at least a portion of a layer onto a substrate, wherein the substrate may comprise previously deposited material; and   (D) forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously deposited layer   wherein the layers comprise at least two different materials and wherein the layers contain patterns of material comprising
 (1) a desired structural component that is to be protected and that is formed from at least one structural material; 
 (2) a protective enclosure that is formed at least in part from a structural material, wherein at least one portion of the enclosure at least partially surrounds the desired structural component, and wherein the enclosure is limited by at least one opening therein; 
 (3) at least one blocking structure located along a line of sight that includes the at least one opening but spaced from the protective enclosure; and 
 (4) a sacrificial material located at least partially between the desired structural component to be protected and at least a portion of the enclosure; 
   wherein after formation of the layers at least portion of the sacrificial material located between the desired structural component and at least a portion of the enclosure is removed,   wherein after the removal of the sacrificial material, a sealing material is deposited such that it strikes said blocking material which inhibits the sealing material from entering the enclosure in bulk, where by continued build up of the sealing material seals the at least one opening to block or significantly limit a passage of material from an outside of the enclosure to an inside of the enclosure via the at least one sealed opening,   wherein the enclosure includes an electrical feed through.   
   
   
       22 . The process of  claim 21  wherein the enclosure includes a lid that includes the electrical feed through. 
   
   
       23 . The process of  claim 22  wherein an electrical connection is made from the electrical feed through to at least a portion of the desired structural component. 
   
   
       24 . The process of  claim 23  wherein the electrical connection includes a compliant element for making a pressure connection. 
   
   
       25 . The process of  claim 21  wherein the enclosure includes a portion that has a thickness no greater than a thickness of a single layer from which the enclosure is formed and wherein the portion is formed from at least two deposited layers of material. 
   
   
       26 . The process of  claim 25  wherein a planarization operation is used in forming each of at least two of the deposited layers that form the portion. 
   
   
       27 . An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
 (A) depositing at least a portion of a layer onto a substrate, wherein the substrate may comprise previously deposited material; and   (B) forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously deposited layer   wherein the layers comprise at least two different materials and wherein the layers contain patterns of material comprising:
 (1) a desired structural component that is to be protected and that is formed from at least one structural material; 
 (2) a protective enclosure that is formed at least in part from a structural material, wherein at least one portion of the enclosure at least partially surrounds the desired structural component, and wherein the enclosure is limited by at least one opening therein; and 
 (3) a sacrificial material located at least partially between the desired structural component to be protected and at least a portion of the enclosure, and 
   wherein, the enclosure includes an electrical feed through.   
   
   
       28 . The process of  claim 27  wherein the enclosure includes a lid that includes the electrical feed through. 
   
   
       29 . The process of  claim 28  wherein an electrical connection is made from the electrical feed through to at least a portion of the desired structural component. 
   
   
       30 . The process of  claim 29  wherein the electrical connection includes a compliant element for making a pressure connection. 
   
   
       31 . The process of  claim 27  wherein the enclosure includes a portion that has a thickness no greater than a thickness of a single layer from which the enclosure is formed and wherein the portion is formed from at least two deposited layers of material. 
   
   
       32 . The process of  claim 31  wherein a planarization operation is used in forming each of at least two of the deposited layers that form the portion.