US2010132380A1PendingUtilityA1

Thermoelectric heat transferring unit

Assignee: DIRECT EQUIPMENT SOLUTIONS GPPriority: Dec 2, 2008Filed: Dec 2, 2008Published: Jun 3, 2010
Est. expiryDec 2, 2028(~2.4 yrs left)· nominal 20-yr term from priority
F24F 5/0042B60H 1/00378B60H 1/00478
28
PatentIndex Score
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Claims

Abstract

A thermoelectric heat transferring unit for transferring heat between an enclosed space and outside of the enclosed space includes a thermoelectric module, a control module, an air intake duct, and an air return duct. The thermoelectric module includes an upper air flow chamber arranged on the enclosed-space side, a lower air flow chamber arranged on the external side, and at least one array of thermoelectric chips sandwiched directly between the upper chamber and the lower chamber. Each of the chambers has a heat sink with heat sink fins and is connected to the thermoelectric chips. The control module controls the heat to be transferred from the upper chamber via the thermoelectric chips to the lower chamber in a cooling mode, and controls the heat to be transferred from the lower chamber via the thermoelectric chips to the upper chamber in a heating mode.

Claims

exact text as granted — not AI-modified
1 . A thermoelectric heat transferring unit for transferring heat between an enclosed space and outside of the enclosed space, comprising:
 an outer casting;   a power supply;   a thermoelectric cooling and heating module;   an electronic control and power module;   fans;   an air intake duct facing towards an external side; and   an air return duct facing towards the external side,   wherein the thermoelectric cooling and heating module includes an upper air flow chamber arranged on the enclosed-space side, a lower air flow chamber arranged on the external side, and at least one array of thermoelectric chips sandwiched directly between the upper air flow chamber and the lower air flow chamber,   said upper air flow chamber has an air inlet and an air outlet communicating with the enclosed space, and said lower air flow chamber is connected with the air intake duct and the air return duct,   each of the chambers has a heat sink with heat sink fins and is connected to the array of thermoelectric chips, and   the electronic control and power module controls the heat to be transferred from said upper air flow chamber via the array of thermoelectric chips to said lower air flow chamber in a cooling mode, and controls the heat to be transferred from said lower air flow chamber via the array of thermoelectric chips to said upper air flow chamber in a heating mode.   
   
   
       2 . The thermoelectric heat transferring unit according to  claim 1 , further comprising a power circuit breaker for the power supply. 
   
   
       3 . The thermoelectric heat transferring unit according to  claim 1 , further comprising a thermal insulation material filled, in void spaces around the thermoelectric cooling and heating module. 
   
   
       4 . The thermoelectric heat transferring unit according to  claim 1 , further comprising a user controller. 
   
   
       5 . The thermoelectric heat transferring unit according to  claim 1 , wherein the power supply consists of batteries. 
   
   
       6 . The thermoelectric heat transferring unit according to  claim 5 , further comprising an alternator that recharges the batteries. 
   
   
       7 . The thermoelectric heat transferring unit according to  claim 1 , wherein the enclosed space is inside a sleeping area of a tractor. 
   
   
       8 . The thermoelectric heat transferring unit according to  claim 1 , wherein the upper air flow chamber includes a divider which divides the upper air flow chamber into right and left sides. 
   
   
       9 . The thermoelectric heat transferring unit according to  claim 8 , wherein the divider is a center ridge ¾ a length of the upper air flow chamber. 
   
   
       10 . The thermoelectric heat transferring unit according to  claim 1 , wherein the air inlet and the air outlet of the upper air flow chamber are arranged on the same side surface of the upper air flow chamber. 
   
   
       11 . The thermoelectric heat transferring unit according to  claim 1 , wherein the air inlet and the air outlet of the upper air flow chamber are arranged on two opposite side surfaces of the upper air flow chamber. 
   
   
       12 . The thermoelectric heat transferring unit according to  claim 1 , further comprising a thermal insulation material filled in spaces in and around the thermoelectric cooling and heating module. 
   
   
       13 . The thermoelectric heat transferring unit according to  claim 1 , wherein the electronic control and power module includes a microprocessor and an H-bridge circuit. 
   
   
       14 . The thermoelectric heat transferring unit according to  claim 13 , wherein an H-bridge circuit includes four transistors, and the H-bridge circuit is configured to control selection of the heating mode or the cooling mode and to perform pulse width modulation for adjusting heating or cooling intensity. 
   
   
       15 . The thermoelectric heat transferring unit according to  claim 1 , wherein one of the fans is provided on each of the air inlet and the air outlet of the upper air flow chamber, and
 one of the fans is provided at where said lower air flow chamber is connected with the air intake duct and at where said lower air flow chamber is connected with the air return duct.   
   
   
       16 . The thermoelectric heat transferring unit according to  claim 15 , wherein the electronic control and power module controls speeds of the fans. 
   
   
       17 . A thermoelectric heat transferring unit for transferring heat between an enclosed space and outside of the enclosed space, comprising:
 a thermoelectric cooling and heating module;   an electronic control and power module;   an air intake duct facing towards an external side; and   an air return duct facing towards the external side,   wherein the thermoelectric cooling and heating module includes an upper air flow chamber arranged on the enclosed-space side, a lower air flow chamber arranged on the external side, and at least one array of thermoelectric chips sandwiched directly between the upper air flow chamber and the lower air flow chamber,   said upper air flow chamber has an air inlet and an air outlet communicating with the enclosed space, and said lower air flow chamber is connected with the air intake duct and the air return duct,   each of the chambers has a heat sink with heat sink fins and is connected to the array of thermoelectric chips, and   the electronic control and power module controls the heat to be transferred from said upper air flow chamber via the array of thermoelectric chips to said lower air flow chamber in a cooling mode, and controls the heat to be transferred from said lower air flow chamber via the array of thermoelectric chips to said upper air flow chamber in a heating mode.   
   
   
       18 . A method for transferring heat between an enclosed space and outside of the enclosed space, comprising:
 providing a thermoelectric heat transferring unit including a thermoelectric cooling and heating module, an electronic control and power module, an air intake duct facing towards an external side, and an air return duct facing towards the external side, the thermoelectric cooling and heating module having an upper air flow chamber arranged on the enclosed-space side, a lower air flow chamber arranged on the external side, and at least one array of thermoelectric chips sandwiched directly between the upper air flow chamber and the lower air flow chamber, said upper air flow chamber having an air inlet and an air outlet communicating with the enclosed space, and said lower air flow chamber being connected with the air intake duct and the air return duct, each of the chambers having a heat sink with heat sink fins and is connected to the array of thermoelectric chips;   transferring the heat from said upper air flow chamber via the array of thermoelectric chips to said lower air flow chamber in a cooling mode; and   transferring the heat from said lower air flow chamber via the array of thermoelectric chips to said upper air flow chamber in a heating mode.

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