Method of forming thick layer by screen printing and method of forming piezoelectric actuator of inkjet head
Abstract
A method to form a thick layer by screen printing and a method to form a piezoelectric actuator of an inkjet head. The method to form the thick layer including forming a guide groove in a surface to a predetermined depth, and forming the thick layer by applying a material to the surface inside the guide groove through screen printing. The method to form the piezoelectric actuator including forming an insulating layer on a top surface of a vibration plate and forming a guide groove in the top surface of the vibration plate or an insulating layer to a predetermined depth at a position corresponding to each of a plurality of pressure chambers, forming a lower electrode on the top surface of the insulating layer; forming a piezoelectric layer inside the guide groove by screen printing, and forming an upper electrode on a top surface of the piezoelectric layer.
Claims
exact text as granted — not AI-modified1 . A method of forming a thick layer on a surface by screen printing, the method comprising:
forming a guide groove in the surface to a predetermined depth; and applying a paste material inside the guide groove formed on the surface through screen printing.
2 . The method of claim 1 , wherein the guide groove has the same contour as a desired contour of the thick layer.
3 . The method of claim 1 , wherein a width of the paste material applied to the inside of the guide groove is smaller than a width of the guide groove such that, the paste material is allowed to spread laterally inside the guide groove and the paste material has a width corresponding to the width of the guide groove and a uniform thickness.
4 . The method of claim 1 , wherein an amount of the paste material applied to the inside of the guide groove is such that a thick layer of the paste material has a uniform thickness.
5 . The method of claim 1 , wherein a thick layer formed of the paste material has a thickness of about several tens of micrometers.Join the waitlist — get patent alerts
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