Semiconductor device

Abstract

Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like.

1 - 10 . (canceled) 
   
   
       11 . A photosensitive resin composition containing a cyclic olefin resin (A) having an epoxy group and a photoacid generator (B), which provides after curing a resin layer having an elastic modulus of 0.1 GPa or more but no more than 2.0 GPa, wherein the cyclic olefin resin (A) having an epoxy group contains a repeating unit represented by the formula (1): 
     
       
         
         
             
             
         
       
     
     wherein X is O, CH 2  or (CH 2 ) 2 ; n is an integer of 0 to 5; R 1  to R 4  are each independently selected from hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a functional group containing an ester group, a functional group containing a ketone group, a functional group containing an ether group, and a functional group containing an epoxy group; R 1  to R 4  may be different in a repetition of a monomer;
 and at least one of R 1  to R 4  in all the repeating units is the functional group having an epoxy group. 
 
   
   
       12 . A photosensitive resin composition according to  claim 11 , wherein the cyclic olefin resin (A) having an epoxy group contains repeating units represented by the formulae (2) and (3): 
     
       
         
         
             
             
         
       
     
     wherein R 1  to R 7  are each independently selected from a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a functional group containing an ester group, a functional group containing a ketone group, and a functional group containing an ether group; and R 1  to R 7  may be different in a repetition of a monomer. 
   
   
       13 . A photosensitive resin composition according to  claim 11 , wherein the cyclic olefin resin (A) having an epoxy group contains repeating units represented by the formulae (4), (5) and (6): 
     
       
         
         
             
             
         
       
     
     wherein n is an integer of 0 to 5; R 1  to R 10  are each independently selected from hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a functional group containing an ester group, a functional group containing a ketone group, and a functional group containing an ether group; and R 1  to R 10  may be different in a repetition of a monomer.