Wafer level interposer

Abstract

Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on said first side of said substrate, and a second plurality of contact elements disposed on said second surface of said substrate, wherein said interposer connects electronic devices via said first and said second plurality of contact elements.

1 . An interposer comprising:
 a substrate having first and second opposed sides with a first set of terminals on the first side, a second set of terminals on the second side, and a means of electrically interconnecting the terminals of the first and second sides;   a first set of resilient contact structures, each having a portion connected to a respective one of the terminals of the first set of terminals, a first contact region distant from the substrate, and an elongate section extending from the portion to the first contact region, the elongate section resiliently bending upon depression of the first contact region towards the substrate; and
 a second set of resilient contact structures, each having a portion attached to a respective one of the terminals of the second set of terminals, a contact region distant from the substrate, and an elongate section extending from the portion to the contact region, the elongate section resiliently bending upon depression of the contact region towards the substrate, 
   wherein upon depression of the first and second contact regions, the interposer causes electrical coupling of two devices.   
   
   
       2 - 35 . (canceled)