Flexible high-temperature ultrabarrier

Abstract

A flexible barrier assembly having a flexible visible light-transmissive substrate having a Tg greater than or equal to that of heat-stabilized polyethylene terephthalate (“HSPET”) overcoated with a first polymer layer having a Tg greater than or equal to that of HSPET and further overcoated with at least two visible light-transmissive inorganic barrier layers separated by at least one second polymer layer having a Tg greater than or equal to that of HSPET can be used to mount, cover, encapsulate or form moisture- and oxygen-sensitive articles such as organic light emitting devices and light valves.

1 . A barrier assembly comprising a flexible visible light-transmissive fluoropolymer substrate overcoated with a first vapor deposited polymer layer and further overcoated with a first visible light-transmissive inorganic barrier layer. 
     
     
         2 . The barrier assembly of  claim 1  further comprising a second polymer layer adjacent the first barrier layer and a second visible light-transmissive inorganic barrier layer opposite the first barrier layer. 
     
     
         3 . The barrier assembly of  claim 2  further comprising a primer layer between the first barrier layer and the second polymer layer. 
     
     
         4 . The barrier assembly of  claim 3  wherein the primer layer is a silicon oxide. 
     
     
         5 . The barrier assembly of  claim 3  wherein the primer layer is a titanium oxide. 
     
     
         6 . The barrier of  claim 1  comprising a top polymer layer adjacent the first barrier layer. 
     
     
         7 . The barrier assembly of  claim 6  further comprising a primer layer between the first barrier layer and the second polymer layer. 
     
     
         8 . The barrier assembly of  claim 7  wherein the primer layer is a silicon oxide. 
     
     
         9 . The barrier assembly of  claim 7  wherein the primer layer is a titanium oxide. 
     
     
         10 . The barrier of  claim 2  comprising a top polymer layer adjacent the second barrier layer. 
     
     
         11 . The barrier assembly of  claim 10  further comprising a primer layer between the first barrier layer and the second polymer layer. 
     
     
         12 . The barrier assembly of  claim 11  wherein the primer layer is a silicon oxide. 
     
     
         13 . The barrier assembly of  claim 11  wherein the primer layer is a titanium oxide. 
     
     
         14 . The barrier assembly of  claim 1  wherein the fluoropolymer layer is a high Tg fluoropolymer. 
     
     
         15 . The barrier assembly of  claim 14  wherein the fluoropolymer is an HTE terpolymer of hexafluoropropylene, tetrafluoroethylene, and ethylene. 
     
     
         16 . The barrier assembly of  claim 1  comprising a pressure sensitive adhesive layer. 
     
     
         17 . The barrier assembly of  claim 1  comprising a hot melt adhesive layer. 
     
     
         18 . The barrier assembly of  claim 1  wherein the first vapor deposited polymer layer is less than 5 micrometers. 
     
     
         19 . An electronic device comprising the barrier assembly of  claim 1 .