US2010112311A1PendingUtilityA1
Structure for pattern formation, method for pattern formation, and application thereof
Est. expiryAug 8, 2017(expired)· nominal 20-yr term from priority
Inventors:Hironori KobayashiManabu YamamotoDaigo AokiHironori KamiyamaShinichi HikosakaMitsuhiro Kashiwabara
Y10T428/24802G02B 5/201G02B 3/0056B41N 1/006G03F 7/0757G03F 7/095G03F 7/0043G02B 3/0012G03F 7/11G03F 7/001G03F 7/0007G03F 7/0005B29D 11/00365B41C 1/1041
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Claims
Abstract
A structure for pattern formation adapted for optically forming a pattern, characterized by comprising: a photocatalyst-containing layer provided on a substrate, the photocatalyst-containing layer containing a material of which the wettability is variable through photocatalytic action upon pattern-wise exposure.
Claims
exact text as granted — not AI-modified1 . A method for pattern formation adapted for optically forming a pattern, wherein
a structure for pattern formation comprises: a substrate; a photocatalyst-containing layer provided on the substrate; and, provided on the photocatalyst-containing layer, a layer containing a material of which wettability is variable through photocatalytic action, and the structure is pattern-wise exposed to vary the wettability of the surface of the structure through photocatalytic action.
2 . The method for pattern formation according to claim 1 , wherein the pattern-wise exposure of the photocatalyst-containing layer is carried out by light beam exposure.
3 . The method for pattern formation according to claim 1 , wherein the pattern-wise exposure of the photocatalyst-containing layer is carried out by exposure through a photomask.
4 . The method for pattern formation according to claim 1 , wherein the pattern-wise exposure of the photocatalyst-containing layer is carried out while heating the structure for pattern formation.
5 . An element comprising the structure for pattern formation adapted for optically forming a pattern,
wherein the structure for pattern formation further comprises: the substrate; the photocatalyst-containing layer provided on the substrate; and, provided on the photocatalyst-containing layer, the layer containing the material of which the wettability is variable through photocatalytic action upon pattern-wise exposure, and wherein a functional layer provided on the structure for pattern formation in its areas corresponding to a pattern, of the structure for pattern formation, obtained by the pattern-wise exposure according to claim 1 .
6 . An element produced by transferring a functional layer onto another substrate, the functional layer being provided on the structure for pattern formation in its areas corresponding to a pattern, of the structure for pattern formation, obtained by the pattern-wise exposure according to claim 1 .
7 . A process for producing an element comprising steps of:
providing the structure for pattern formation adapted for optically forming a pattern which comprises: the substrate; the photocatalyst-containing layer provided on the substrate; and, provided on the photocatalyst-containing layer, the layer containing the material of which the wettability is variable through photocatalytic action upon pattern-wise exposure, and forming a functional layer provided on the structure for pattern formation in its areas corresponding to a pattern, of the structure for pattern formation, obtained by the pattern-wise exposure according to claim 1 .
8 . A process for producing an element comprising a step of transferring a functional layer onto another substrate, the functional layer being provided on the structure for pattern formation in its areas corresponding to a pattern, of the structure for pattern formation, obtained by the pattern-wise exposure according to claim 1 , whereby the functional layer is formed on the another substrate.
9 . The process for producing an element according to claim 7 , comprising the steps of : forming a composition for a functional layer onto the whole surface of the structure for pattern formation; and forming a patterned functional layer on the structure for pattern formation only in its wettability-varied exposed areas by utilizing repellency of unexposed areas.
10 . The process for producing an element according to claim 7 , comprising the steps of : forming a composition for a functional layer onto the whole surface of the structure for pattern formation; and forming a patterned functional layer on the structure for pattern formation by removing the functional layer in its unexposed areas to from a patterned functional layer.
11 . The process for producing an element according to claim 8 , comprising the steps of : forming a composition for a functional layer onto the whole surface of the structure for pattern formation; and forming a patterned functional layer on the structure for pattern formation only in its wettability-varied exposed areas by utilizing repellency of unexposed areas.
12 . The process for producing an element according to claim 8 , comprising the steps of : forming a composition for a functional layer onto the whole surface of the structure for pattern formation; and forming a patterned functional layer on the structure for pattern formation by removing the functional layer in its unexposed areas to from a patterned functional layer.
13 . The process for producing an element according to claim 7 , wherein the functional layer is formed on the structure for pattern formation by coating a composition for a functional layer.
14 . The process for producing an element according to claim 8 , wherein the functional layer is formed on the structure for pattern formation by coating a composition for a functional layer.
15 . The process for producing an element according to claim 7 , wherein the functional layer is formed on the structure for pattern formation by ejecting a composition for a functional layer through a nozzle.
16 . The process for producing an element according to claim 8 , wherein the functional layer is formed on the structure for pattern formation by ejecting a composition for a functional layer through a nozzle.
17 . The process for producing an element according to claims 7 , wherein the functional layer is formed on the structure for pattern formation by thermal or pressure transfer from a film coated with a composition for a functional layer.
18 . The process for producing an element according to claims 8 , wherein the functional layer is formed on the structure for pattern formation by thermal or pressure transfer from a film coated with a composition for a functional layer.
19 . The process for producing an element according to claim 7 , wherein the functional layer is formed on the structure for pattern formation by film formation utilizing vacuum.
20 . The process for producing an element according to claim 8 , wherein the functional layer is formed on the structure for pattern formation by film formation utilizing vacuum.
21 . The process for producing an element according to claim 7 , wherein the functional layer is formed on the structure for pattern formation by film formation utilizing electroless plating.
22 . The process for producing an element according to claim 8 , wherein the functional layer is formed on the structure for pattern formation by film formation utilizing electroless plating.Join the waitlist — get patent alerts
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