Electronic component, mounting structure thereof, and method for mounting electronic component

Abstract

An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.

1 . An electronic component, comprising:
 a functional piece having a predetermined function;   a bump electrode formed on the functional piece, the bump electrode avoiding a functional section of the functional piece, the bump electrode including:
 a core with elastic property; and 
 a conductive film provided on a surface of the core; and 
   a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit,   wherein the electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.   
   
   
       2 . An electronic component, comprising:
 a functional piece having a predetermined function, the functional piece including:
 a base; and 
 arms extending from the base; and 
   a bump electrode formed on the base of the functional piece, the bump electrode including:
 a core with elastic property; and 
 a conductive film provided on a surface of the core; and 
   a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit,   wherein the electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.