Electronic component package and manufacturing method thereof

Abstract

An electronic component package and a manufacturing method thereof. The electronic component package includes: an insulation layer; a single layer of circuit pattern buried in the insulation layer and having a surface exposed at one side of the insulation layer, the circuit pattern comprising a bonding pad and a solder ball pad; and an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad. In addition, the electronic component package includes a portion of the insulation layer being removed in correspondence with the position of the solder ball pad such that the solder ball pad is exposed at the other side of the insulation layer.

1 . An electronic component package comprising:
 an insulation layer;   a single layer of circuit pattern buried in the insulation layer and having a surface exposed at one side of the insulation layer, the circuit pattern comprising a bonding pad and a solder ball pad; and   an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad.   
     
     
         2 . The electronic component package of  claim 1 , wherein a portion of the insulation layer is removed in correspondence with the position of the solder ball pad such that the solder ball pad is exposed at the other side of the insulation layer.