Method and device for tempering electronic components

Abstract

Disclosed are a method and a device for tempering electronic components ( 5 ) within a handler ( 1 ) for a functional test. The components ( 5 ) are initially pre-tempered in a temperature chamber ( 2 ) by convecting a gas and are then directly tempered in a conductive manner to the test temperature in a test chamber ( 3 ). The gas pressure (P 1 ) inside the test chamber ( 3 ) is greater than the gas pressure (P 2 ) in the temperature chamber while the gas pressure (P 2 ) in the temperature chamber ( 2 ) is greater than the ambient pressure (P a ). The inlet ( 4 ) and outlet ( 29 ) of the temperature chamber ( 2 ) are alternately opened and closed.

1 . Method for tempering electronic components within a handler for a functional test, wherein the components are initially pre-tempered in a temperature chamber by convecting a gas to a certain temperature and are then directly tempered in a conductive manner to the test temperature in a test chamber by contact with a heated chuck and/or by heated gas flowing in a controlled way directly in the opposite direction to the components arranged in the chuck, wherein the temperature chamber has an inlet for introducing the components into the temperature chamber and a outlet for removing the components from the temperature chamber and wherein the gas pressure inside the temperature chamber and test chamber is maintained greater than the ambient pressure (Pa), wherein the gas pressure (E 1 ) inside the test chamber is maintained greater than the gas pressure (P 2 ) in the temperature chamber, and in that the inlet and the outlet are alternately opened and closed so that the gas flows uni-directionally from the test chamber into the temperature chamber and from this into the atmosphere. 
   
   
       2 . Method according to  claim 1 , wherein additionally dry gas is fed into the test chamber. 
   
   
       3 . Method according to  claim 2 , wherein the dry gas consists of dried ambient air. 
   
   
       4 . Device for tempering electronic components within a handler for a functional test, comprising a temperature chamber, in which the components are pre-tempered to a certain temperature by convecting a gas fed in the temperature chamber, and a test chamber having a chuck for the components, in which direct tempering of the components to the test temperature is performed in a conductive manner by contact with a heated chuck and/or by heated gas flowing in a controlled way in the opposite direction to the components, wherein the gas pressure inside the temperature chamber and test chamber is greater than the ambient pressure (Pa), and wherein the temperature chamber has an inlet for introducing the components into the temperature chamber and an outlet for removing the components from the temperature chamber, wherein the gas pressure (P 1 ) inside the test chamber is greater than the gas pressure (P 2 ) inside the temperature chamber and in that the inlet and the outlet are controlled in such a way that they are alternately opened and closed. 
   
   
       5 . Device according to  claim 4 , wherein the test chamber is connected with a supply unit for dry gas. 
   
   
       6 . Device according to  claim 4 , wherein temperature chamber and test chamber are designed as single modules in each case.