Methods and apparatus for polishing an edge and/or notch of a substrate

Abstract

Apparatus and methods are provided to polish a substrate. In some aspects, the invention includes a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge. The polishing head includes a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch. Numerous other aspects are provided.

1 . An apparatus for polishing a substrate comprising:
 a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge, including:   a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch.   
   
   
       2 . The apparatus of claim of  claim 1  wherein the polisher is selectively inflatable. 
   
   
       3 . The apparatus of  claim 1  wherein the hollow portion is adapted to retain a fluid. 
   
   
       4 . The apparatus of  claim 3  wherein the polisher further comprises a port adapted to receive the fluid. 
   
   
       5 . The apparatus of  claim 4  wherein the fluid is compressed air. 
   
   
       6 . The apparatus of  claim 1  wherein the polishing head is adapted to pivot about at least one of the substrate edge and the notch. 
   
   
       7 . The apparatus of  claim 1  wherein the polishing tape is adapted to advance over the polisher during application of the polishing tape to at least one of the substrate edge and the notch. 
   
   
       8 . The apparatus of  claim 1  wherein the polisher includes a notch portion. 
   
   
       9 . A system for polishing a substrate comprising:
 a substrate support adapted to rotate a substrate;   a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge, including:
 a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch; and 
   a controller adapted to operate the rotation of the substrate and the polishing head.   
   
   
       10 . The system of  claim 9  wherein the controller is adapted to incrementally advance the polishing tape to the polishing head. 
   
   
       11 . The system of  claim 9  wherein the hollow portion is adapted to retain a fluid. 
   
   
       12 . The system of  claim 11  wherein the polisher further comprises a port adapted to receive the fluid. 
   
   
       13 . The system of  claim 12  further comprising a sensor adapted to sense a pressure applied by the fluid. 
   
   
       14 . The system of  claim 13  wherein the sensor is coupled to the controller, and the controller is adapted to receive a signal from the sensor indicative of the applied pressure. 
   
   
       15 . The system of  claim 11  wherein the controller is adapted to adjust a pressure applied to at least one of the substrate edge and notch by the fluid. 
   
   
       16 . The system of  claim 15  further comprising a valve, wherein the valve is coupled to the polisher, and wherein the controller is adapted to manipulate the valve to adjust the applied pressure. 
   
   
       17 . The system of  claim 15  wherein the controller is adapted to increase the applied pressure by increasing the fluid retained in the hollow portion. 
   
   
       18 . The system of  claim 9  wherein the polisher includes a notch portion. 
   
   
       19 . The system of  claim 9  wherein the polishing head is adapted to pivot about at least one of the substrate edge and the notch. 
   
   
       20 . A method for polishing a substrate comprising:
 securing a substrate on a support;   pressing a polishing tape against at least one of a substrate edge and a notch with a hollow polisher;   advancing the polishing tape as the polishing tape is pressed against the notch; and   monitoring the polishing process.   
   
   
       21 . The method of  claim 20  further comprising:
 inflating the hollow polisher.   
   
   
       22 . The method of  claim 21  wherein monitoring the polishing process further comprises:
 receiving a signal indicative of the pressure applied by the inflated polisher.   
   
   
       23 . The method of  claim 22  further comprising:
 adjusting the pressure based on the received signal.   
   
   
       24 . The method of  claim 23  wherein adjusting the pressure further comprises one of:
 inflating the hollow polisher and deflating the hollow polisher.   
   
   
       25 . The method of  claim 24  wherein inflating the hollow polishing pad further comprises:
 flowing a fluid into the hollow polisher.