Methods and apparatus to minimize the effect of tape tension in electronic device polishing

Abstract

Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher; and one or more pairs feed guides. Numerous other aspects are provided.

1 . An apparatus comprising:
 a polishing head, adapted to contact a substrate, wherein the polishing head includes:
 a polishing unit comprising a polisher and at least one pair of tension distributors positioned to reduce tension on the polisher; and 
 one or more pairs of feed guides. 
   
   
   
       2 . The apparatus of  claim 1  wherein the polishing head is adapted to pivot about an edge of the substrate. 
   
   
       3 . The apparatus of  claim 2  wherein the polishing head is adapted to maintain a balanced position while the polishing head pivots about the edge of the substrate. 
   
   
       4 . The apparatus of  claim 3  wherein the balanced position provides for an angle between the feed guides and the tension distributors to be substantially zero. 
   
   
       5 . The apparatus of  claim 1  wherein the polishing unit is adapted to pivot about an edge of the substrate, and the polishing head is adapted to maintain a fixed position relative to the polishing unit as the polishing unit pivots about the substrate edge. 
   
   
       6 . The apparatus of  claim 1  wherein the polisher is adapted to press a polishing tape against the substrate. 
   
   
       7 . The apparatus of  claim 6  wherein the polishing head includes two pairs of feed guides. 
   
   
       8 . The apparatus of  claim 7  wherein the feed guides are in a stationary location with respect to the polishing head. 
   
   
       9 . The apparatus of  claim 7  wherein the polishing tape is routed through a first pair of feed guides, through the polishing unit and then a second pair of feed guides. 
   
   
       10 . The apparatus of  claim 9  wherein the polishing unit and first and second pairs of feed guides are adapted to receive the polishing tape while remaining coupled to the polishing head. 
   
   
       11 . The apparatus of  claim 1  wherein the polisher, tension distributors and feed guides are adapted to rotate. 
   
   
       12 . The apparatus of  claim 1  further comprising a plurality of fasteners adapted to couple the tension distributors to the polishing unit. 
   
   
       13 . A system comprising:
 a substrate support adapted to rotate a substrate;   a polishing head, adapted to contact a substrate, wherein the polishing head comprises:
 a polishing unit comprising a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher, and 
 one or more pairs of feed guides; and 
   a controller adapted to operate the polishing head.   
   
   
       14 . The system of  claim 13  wherein the controller is adapted to move the polishing head into a balanced position relative to an edge of a substrate. 
   
   
       15 . The system of  claim 14  wherein the balanced position provides for an angle between the feed guides and the tension distributors to be substantially zero. 
   
   
       16 . The system of  claim 14  wherein the controller is adapted to move the polishing unit relative to the polishing head. 
   
   
       17 . The system of  claim 13  wherein the polisher is adapted to press a polishing tape against the substrate. 
   
   
       18 . The system of  claim 17  wherein the polishing head includes two pairs of feed guides. 
   
   
       19 . The system of  claim 18  wherein the polishing tape is routed through a first pair of feed guides, through the polishing unit and then a second pair of feed guides. 
   
   
       20 . A method comprising:
 rotating a substrate;   selecting a balanced position for a polishing head;   contacting the substrate with a polishing film, whereby the polishing film is routed through the polishing head;   applying a force to the substrate via the polishing film; and   pivoting the polishing head about the substrate.   
   
   
       21 . The method of  claim 20  wherein the polishing head comprises:
 a polishing unit comprising a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher.   
   
   
       22 . The method of  claim 21  wherein the polishing head further comprises:
 one or more pairs feed guides.   
   
   
       23 . The method of  claim 22  further comprising:
 pivoting the polishing unit about an edge of the substrate.   
   
   
       24 . The method of  claim 23  further comprising:
 maintaining a fixed position of the polishing head relative to the polishing unit as the polishing unit pivots about the edge of the substrate.