US2010105291A1PendingUtilityA1

Methods and apparatus for polishing a notch of a substrate

48
Assignee: APPLIED MATERIALS INCPriority: Oct 24, 2008Filed: Oct 24, 2008Published: Apr 29, 2010
Est. expiryOct 24, 2028(~2.2 yrs left)· nominal 20-yr term from priority
Inventors:Gary C. EttingerPaul D. ButterfieldAntoine P. ManensSen-Hou Ko
B24B 49/16B24B 1/04B24B 9/065
48
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Claims

Abstract

Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing tape. Numerous other aspects are provided.

Claims

exact text as granted — not AI-modified
1 . An apparatus for polishing a notch of a substrate comprising:
 a polishing head adapted to apply a polishing tape against the notch of the substrate, including:
 a plunger; and 
 an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing tape. 
   
   
   
       2 . The apparatus of  claim 1  wherein the actuator is adapted to press the plunger into polishing tape and thereby press the polishing tape against the notch. 
   
   
       3 . The apparatus of  claim 1  wherein the polishing head is adapted to pivot about the notch. 
   
   
       4 . The apparatus of  claim 1  wherein the plunger is adapted to pivot about the notch. 
   
   
       5 . The apparatus of  claim 1  wherein the polishing tape is adapted to advance over the plunger during application of the polishing tape to the notch. 
   
   
       6 . The apparatus of  claim 5  wherein the polishing tape is adapted to vibrate as the polishing tape advances over the plunger. 
   
   
       7 . The apparatus of  claim 1  wherein the plunger is adapted to conform the polishing tape to a shape of the notch. 
   
   
       8 . The apparatus of  claim 7  wherein the plunger has a shape that corresponds to a shape of the notch. 
   
   
       9 . The apparatus of  claim 1  wherein the polishing head is adapted to continuously oscillate around the notch. 
   
   
       10 . The apparatus of  claim 1  wherein the plunger is a pneumatic plunger. 
   
   
       11 . A system for polishing a notch of a substrate comprising:
 a substrate support adapted to rotate a substrate;   a polishing head adapted to apply a polishing tape against the notch of the substrate, including:
 a plunger; and 
 an actuator, wherein the actuator is adapted to press the plunger into polishing tape and thereby press the polishing tape against the notch; and 
 a controller adapted to operate the rotation of the substrate and the actuator. 
   
   
   
       12 . The system of  claim 11  wherein the controller is adapted to incrementally advance the polishing tape to the polishing head. 
   
   
       13 . The system of  claim 11  wherein the actuator includes a pressure sensor adapted to sense the pressure exerted by the actuator on the plunger. 
   
   
       14 . The system of  claim 13  wherein the controller is adapted to receive a signal from the pressure sensor indicative of the pressure exerted by the actuator on the plunger. 
   
   
       15 . The system of  claim 11  wherein the polishing head is adapted to pivot about the notch. 
   
   
       16 . The apparatus of  claim 11  wherein the plunger is adapted to pivot about the notch. 
   
   
       17 . The apparatus of  claim 11  wherein the polishing tape is adapted to advance over the plunger during application of the polishing tape to the notch. 
   
   
       18 . The apparatus of  claim 11  wherein the plunger is adapted to conform the polishing tape to a shape of the notch. 
   
   
       19 . The apparatus of  claim 18  wherein the plunger has a shape that corresponds to a shape of the notch. 
   
   
       20 . A method for polishing a notch of a substrate comprising:
 securing a substrate on a support;   aligning a substrate notch with a polishing head including a plunger;   pressing a polishing tape against a notch with the plunger; and   advancing the polishing tape as the polishing tape is pressed against the notch.   
   
   
       21 . The method of  claim 20  further comprising:
 pivoting the polishing head about the substrate notch.   
   
   
       22 . The method of  claim 20  further comprising:
 receiving a signal indicative of the pressure applied to the plunger.   
   
   
       23 . The method of  claim 22  further comprising:
 adjusting the pressure based on the received signal.   
   
   
       24 . The method of  claim 20  further comprising:
 vibrating the polishing tape as the polishing tape advances.   
   
   
       25 . The method of  claim 20  further comprising
 advancing the polishing tape continuously.

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