US2010104760A1PendingUtilityA1

Vacuum exhaust method and a substrate processing apparatus therefor

Assignee: TOKYO ELECTRON LTDPriority: Oct 27, 2008Filed: Oct 27, 2009Published: Apr 29, 2010
Est. expiryOct 27, 2028(~2.3 yrs left)· nominal 20-yr term from priority
H10P 95/00B08B 7/0035B08B 5/04C23C 16/4412C23C 16/4401B08B 6/00B08B 7/04
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Claims

Abstract

A vacuum exhaust method of a substrate processing apparatus, after opening to the atmosphere, depressurizes a vacuum processing chamber having therein a mounting table for mounting a target substrate thereon. The vacuum exhaust method includes covering a surface of the mounting table with a protection member; sealing the vacuum processing chamber; vacuum evacuating the sealed vacuum processing chamber; and adsorbing at least one of foreign substances and out-gases by the protection member.

Claims

exact text as granted — not AI-modified
1 . A vacuum exhaust method of a substrate processing apparatus including a vacuum processing chamber having therein a mounting table for mounting a target substrate thereon, the vacuum exhaust method comprising:
 opening the vacuum processing chamber to the atmosphere;   covering a surface of the mounting table with a protection member;   sealing the vacuum processing chamber;   vacuum evacuating the sealed vacuum processing chamber; and   adsorbing at least one of foreign substances and out-gases by the protection member.   
   
   
       2 . The vacuum exhaust method of  claim 1 , wherein said vacuum evacuating includes cooling the protection member to exert a thermophoretic force on a foreign substance being adsorbed in the protection member. 
   
   
       3 . The vacuum exhaust method of  claim 1 , wherein the vacuum evacuating includes charging the protection member to apply an electrostatic force to a foreign substance being adsorbed in the protection member. 
   
   
       4 . The vacuum exhaust method of  claim 1 , wherein after the vacuum evacuating, the protection member is accommodated in a waiting chamber outside the vacuum processing chamber, and before vacuum evacuating the vacuum processing chamber again, the protection member is unloaded from the waiting chamber and loaded in the vacuum processing chamber. 
   
   
       5 . The vacuum exhaust method of  claim 4 , further comprising regenerating an used protection member in the waiting chamber. 
   
   
       6 . The vacuum exhaust method of  claim 5 , wherein said regenerating includes blowing a gas or an aerosol to the used protection member to remove said at least one of the foreign substances and the out-gases adsorbed in the protection member. 
   
   
       7 . The vacuum exhaust method of  claim 5 , wherein said regenerating includes heating the used protection member to exert a thermophoretic force on the foreign substances adsorbed in the protection member so that the foreign substances are detached from the protection member. 
   
   
       8 . The vacuum exhaust method of  claim 7 , wherein said heating includes applying an ultrasonic wave to the protection member to vibrate a surface of the protection member. 
   
   
       9 . The vacuum exhaust method of  claim 7 , wherein the heating includes irradiating light onto the protection member to cause thermal vibration or energy vibration to vibrate a surface of the substrate. 
   
   
       10 . A substrate processing apparatus comprising:
 a mounting table for mounting a target substrate thereon;   a vacuum processing chamber in which the mounting table is provided;   an exhaust unit for evacuating the vacuum processing chamber; and   an adsorption layer coating a surface of the mounting table and, during evacuating the vacuum processing chamber, adsorbing at least one of foreign substances and out-gases.   
   
   
       11 . The substrate processing apparatus of  claim 10 , wherein the adsorption layer is a layer of a mesh structure made of inorganic fibers, or a woven or a nonwoven fabric structure. 
   
   
       12 . The substrate processing apparatus of  claim 10 , wherein the adsorption layer is formed of mesh-structured activated carbon, or a woven or a nonwoven fabric-structured carbon fibers. 
   
   
       13 . The substrate processing apparatus of  claim 10 , wherein the adsorption layer includes a resin sheet layer on its backside surface. 
   
   
       14 . A substrate processing apparatus comprising:
 a vacuum processing chamber;   a mounting table provided in the vacuum processing chamber to mount a target substrate thereon;   an exhaust unit for depressurizing an interior of the vacuum processing chamber;   a protection member that, during vacuum evacuation of the interior of the vacuum processing chamber by the exhaust unit, covers a surface of the mounting table, and, after vacuum evacuation by the exhaust unit, is moved to the outside of the vacuum processing chamber for waiting; and   an waiting chamber for accommodating the protection member outside of the vacuum processing chamber.   
   
   
       15 . The substrate processing apparatus of  claim 14 , further comprising a regeneration unit provided in the waiting chamber to regenerate an used protection member.

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