multi-configuration processor-memory substrate device

Abstract

A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-electrically functional area of the PCB interface of the printed circuit board to dissipate heat.

1 . A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface of a printed circuit board comprising:
 a substrate having a first configuration and a second configuration, wherein the substrate is configured for mounting a processor and a first number of memory components in the first configuration, and mounting the processor and an additional number of memory components in the second configuration; and   an interface built into the substrate for coupling to a PCB interface of a printed circuit board.   
     
     
         2 . The device of  claim 1  wherein the memory components and the processor are surface mounted on the substrate. 
     
     
         3 . The device of  claim 1  wherein the processor is mounted on the substrate in a flip chip configuration. 
     
     
         4 . The device of  claim 3  wherein the processor is mounted on the substrate in a flip chip configuration on an opposite side of the substrate mounting the memory components. 
     
     
         5 . The device of  claim 1  wherein the processor is a GPU (graphics processor unit). 
     
     
         6 . The device of  claim 1  wherein the memory components are DDR (double data rate) memory components. 
     
     
         7 . The device of  claim 6  wherein the memory components are packaged memory components. 
     
     
         8 . The device of  claim 1  wherein the processor is mounted on the substrate in a flip chip configuration on the same side of the substrate as the interface. 
     
     
         9 . The device of  claim 8  wherein a surface of the processor is configured for an attachment to an area of the PCB interface of the printed circuit board to conduct heat from the processor through the attachment. 
     
     
         10 . The device of  claim 9  wherein the attachment is a solder attachment. 
     
     
         11 . The device of  claim 9  wherein the attachment is an adhesive attachment. 
     
     
         12 . The device of  claim 1  wherein the memory components are configured to receive a heat spreader to conduct heat from the memory components. 
     
     
         13 . The device of  claim 1  wherein the first number of memory components of the first configuration is two memory components and the second number of memory components of the second configuration is at least four memory components. 
     
     
         14 . A Multi-configuration GPU (graphics processor unit) package for coupling to a PCB (printed circuit board) interface of a printed circuit board comprising:
 a substrate having a first configuration and a second configuration, wherein the substrate is configured for mounting a GPU and a first number of memory components in the first configuration, and mounting the GPU and an additional number of memory components in the second configuration; and   a common interface built into the substrate for coupling to a PCB interface of a printed circuit board, wherein the common interface is configured to provide a standardized interconnection to the PCB interface for both the first configuration and the second configuration.   
     
     
         15 . The package of  claim 14  wherein the GPU is mounted on the substrate in a flip chip configuration on a side of the substrate opposite the memory components, and wherein the GPU includes a heat conduction surface configured for an attachment to the PCB interface of the printed circuit board for conducting heat from the GPU through the attachment. 
     
     
         16 . The package of  claim 15  wherein the GPU is mounted on the substrate coplanar with a solder ball plane of the common interface to implement the attachment to the PCB interface of the printed circuit court. 
     
     
         17 . The package of  claim 15  wherein the attachment is implemented using solder. 
     
     
         18 . The package of  claim 15  wherein the attachment is implemented using adhesive. 
     
     
         19 . The device of  claim 15  wherein the memory components are surface mounted on the substrate. 
     
     
         20 . The device of  claim 15  wherein the memory components are packaged DDR (double data rate) memory components. 
     
     
         21 . The device of  claim 15  wherein the memory components are configured to receive a heat spreader to conduct heat from the memory components. 
     
     
         22 . The device of  claim 15  wherein the socket includes a non-electrically-functional area for implementing the attachment to the heat conduction surface of the GPU and wherein the nonfunctional area has a grid disposed thereon to accept a plurality of solder balls to implement the attachment. 
     
     
         23 . The device of  claim 22  wherein the grid is comprised of a soldermask material deposited using an SMOBC (solder mask over bare copper) process. 
     
     
         24 . The device of  claim 22  wherein the grid is comprised of a metallic material formed using an etching process. 
     
     
         25 . A Multi-configuration GPU (graphics processor unit) device for coupling to a printed circuit board comprising:
 a substrate having a first configuration and a second configuration, wherein the substrate is configured for mounting a GPU and a first number of memory components in the first configuration, and mounting the GPU and an additional number of memory components in the second configuration;   a common interface built into the substrate for coupling to a PCB (printed circuit board) interface of a printed circuit board, wherein the common interface is configured to provide a standardized interconnection to the PCB interface for both the first configuration and the second configuration; and   a heat spreader coupled to the memory components to conduct heat from the memory components independent of heat from the GPU.   
     
     
         26 . The package of  claim 25  wherein the GPU is mounted on the substrate in a flip chip configuration on a side of the substrate opposite the memory components, and wherein the GPU includes a heat conduction surface configured for attaching to a heat sink, wherein the heat sink is configured to protrude through an opening of the printed circuit board and conduct heat from the GPU through the opening to a side of the printed circuit board opposite the GPU device. 
     
     
         27 . The device of  claim 25  wherein the memory components are surface mounted on the substrate. 
     
     
         28 . The device of  claim 25  wherein the memory components are packaged DDR (double data rate) memory components.