Multi-configuration processor-memory substrate device

Abstract

A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-electrically functional area of the PCB interface of the printed circuit board to dissipate heat.

1 . A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface of a printed circuit board comprising:
 a substrate having a first configuration and a second configuration, wherein the substrate is configured for mounting a processor and a first number of memory components in the first configuration, and mounting the processor and an additional number of memory components in the second configuration;   an interface built into the substrate for coupling to a PCB interface of a printed circuit board; and   wherein the processor is mounted on the substrate in a flip chip configuration near the interface of the substrate, and wherein the memory components and the processor are surface mounted on the substrate, and wherein the processor has a ball grid array for mounting on the substrate.   
     
     
         2 . The device of  claim 1  wherein the processor is mounted on the substrate on an opposite side of the substrate mounting the memory components. 
     
     
         3 . The device of  claim 1  wherein the processor is a GPU (graphics processor unit). 
     
     
         4 . The device of  claim 1  wherein the memory components are DDR (double data rate) memory components. 
     
     
         5 . The device of  claim 4  wherein the memory components are packaged memory components. 
     
     
         6 . The device of  claim 1  wherein the processor is mounted near the interface of the substrate. 
     
     
         7 . The device of  claim 6  wherein a surface of the processor is configured for an attachment to an area of the PCB interface of the print circuit board to conduct heat from the processor through the attachment. 
     
     
         8 . The device of  claim 7  wherein the attachment is a solder attachment. 
     
     
         9 . The device of  claim 1  wherein the memory components are configured to receive a heat spreader to conduct heat from the memory components. 
     
     
         10 . The device of  claim 1  wherein the first number of memory components of the first configuration is 2 memory components and the second number of memory components of the second configuration is at least four memory components. 
     
     
         11 . A Multi-configuration GPU (graphics processor unit) package for coupling to a PCB (printed circuit board) interface of a printed circuit board comprising:
 a substrate having a first configuration and a second configuration, wherein the substrate is configured for mounting a GPU and a first number of memory components in the first configuration, and mounting the GPU and an additional number of memory components in the second configuration;   a common interface built into the substrate for coupling to a PCB interface of a printed circuit board, wherein the common interface is configured to provide a standardized interconnection to the PCB interface for both the first configuration and the second configuration; and.   wherein the GPU is mounted on the substrate in a flip chip configuration on a side of the substrate opposite the memory components, and wherein the GPU includes a heat conduction surface configured for an attachment to the PCB interface of the printed circuit board for conducting heat from the GPU through the attachment, and wherein the GPU has a ball grid array for mounting on the substrate.   
     
     
         12 . The package of  claim 11  wherein the GPU is mounted on the substrate coplanar with a solder ball plane of the common interface to implement the attachment to the PCB interface of the printed circuit court. 
     
     
         13 . The package of  claim 11  wherein the attachment is implemented using solder. 
     
     
         14 . The device of  claim 11  wherein the memory components are surface mounted on the substrate. 
     
     
         15 . The device of  claim 11  wherein the memory components are configured to receive a heat spreader to conduct heat from the memory components.