Semiconductor device manufacturing method, semiconductor device, and wiring board

Abstract

A semiconductor device manufacturing method includes (a) bonding a first surface of a metal plate to a substrate, (b) forming a plurality of metal posts that are arranged in vertical and lateral directions in a plan view and include a first metal post and a second metal post, by partially etching the metal plate bonded to the substrate from a second surface of the metal plate, (c) fixing an integrated circuit (IC) element to the second surface of the first metal post, (d) coupling the second metal post and a pad terminal of the integrated circuit element via a conductive material, (e) resin-sealing the integrated circuit element, the metal posts, and the conductive material by providing a resin onto the substrate, and (f) removing the substrate from the resin and the first surfaces of the metal posts sealed using the resin.

1 . A semiconductor device comprising:
 a plurality of metal posts each having a first surface and a second surface facing a side opposite to the first surface, the metal posts arranged in vertical and lateral directions in a plan view, the metal posts including a first metal post and a second metal post;   an integrated circuit element fixed to the first surface of the first metal post;   a conductive material, the conductive material coupling the first surface of the second metal post and a pad terminal of the integrated circuit element, and the conductive material, wherein   the second surfaces of the metal posts are exposed from the resin.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein
 the first and second posts are all formed to have identical shapes and identical sizes.   
     
     
         3 . The semiconductor device according to  claim 1 , wherein
 a plated layer for solder joint is formed on the second surfaces of the metal posts.   
     
     
         4 . A wiring board to be used to fix an integrated circuit element and draw a pad terminal of the integrated circuit element to outside, the wiring board comprising:
 a substrate; and   a plurality of metal posts arranged in vertical and lateral directions in a plan view on the substrate, wherein   the substrate and the metal posts are bonded together via a type of adhesive that loses adhesion force thereof if the adhesive is subjected to a predetermined process.   
     
     
         5 . The wiring board according to  claim 4 , wherein
 the metal posts are all formed to have identical shapes and identical sizes.