High strength copper alloy for electronic parts and electronic parts

Abstract

A copper base alloy for electronic parts containing 2.0 to 4.0 mass % of Ti and 0.05 to 0.50 mass % of one or more of Fe, Co, Ni, Si, Cr, V, Nb, Zr, B and P, wherein the content of other impurity elements is 0.010 mass % or less in total, and the content of each of C and O is 0.010 mass % or less. This copper base alloy can be used without heat treatment after its press working into a part of a connector or the like; or can be also used in a state in which the alloy is subjected to a specific heat treatment so as to be improved in spring characteristics after its press working.

1 . A copper alloy for electronic components comprising 2.0-4.0 mass % of Ti, 0.05-0.50 mass % in total of one or more elements selected from the group consisting of Fe, Co, Ni, Si, Cr, V, Nb, Zr, B and P, and the balance being Cu and other impurity elements,
 wherein the total amount of other impurity elements is 0.050 mass % or less; and the contents of each C and O are 0.010 mass % or less.   
     
     
         2 . A copper alloy for electronic components comprising 2.0-4.0 mass % of Ti, 0.05-0.50 mass % of Fe, and the balance being Cu and other impurity elements,
 wherein the total amount of other impurity elements is 0.050 mass % or less; and the contents of each C and O are 0.010 mass % or less.   
     
     
         3 . The electronic component prepared from the copper alloy of  claim 1  or  2  wherein the hardness is adjusted by heat treatment at a temperature of 400° C. or less after pressing of the copper alloy into a predetermined shape.