Methods and apparatus for recovering heat from processing systems
Abstract
Methods and apparatus for recovering heat from disposed effluents are disclosed herein. In some embodiments, an apparatus may include a first process chamber configured for gaseous or liquid processes; a second process chamber configured for liquid processes; and a heat pump having a compressor and a first heat exchanger, wherein the compressor is configured to use a first effluent exhausted from the first process chamber and wherein the first heat exchanger having first and second sides configured to transfer heat therebetween, wherein the first side is configured to flow a liquid reagent therethrough and into the second process chamber, and wherein the second side is configured to flow the pressurized first effluent from the first process chamber therethrough. In some embodiments, a heater may be disposed between the heat pump and the second process chamber to further heat the liquid reagent prior to entering the second process chamber.
Claims
exact text as granted — not AI-modified1 . A substrate processing system, comprising:
a process chamber configured for liquid processes; a first heat exchanger having first and second sides configured to transfer heat therebetween, wherein the first side is configured to flow a liquid reagent therethrough and into the process chamber, and wherein the second side is configured to flow an effluent from the process chamber therethrough; and a heater disposed in line with the first side of the first heat exchanger to heat the liquid reagent prior to entering the process chamber.
2 . The system of claim 1 , further comprising:
an intermediate reservoir disposed between the process chamber and the first heat exchanger to collect effluent from the process chamber and to pump the effluent through the first heat exchanger.
3 . The system of claim 1 , further comprising:
a first waste heat source for providing a first waste fluid having waste heat stored therein; a heat pump coupled between the first waste heat source and an incoming fluid line that flows the liquid reagent into the process chamber, the heat pump configured to transfer heat from the first waste heat source to the liquid reagent in the incoming fluid line.
4 . The system of claim 3 , wherein the heat pump is disposed between the heater and the first heat exchanger.
5 . The system of claim 3 , wherein the waste heat source includes one or more of a process chamber configured for liquid or gaseous processes, a compressed air system, an air separation compressor, an air compressor, or an abatement device.
6 . The system of claim 3 , further comprising:
a second waste heat source, to provide a second waste heat fluid having waste heat stored therein to the heat pump to transfer the waste heat stored therein to the liquid reagent in the incoming fluid line.
7 . The system of claim 1 , further comprising:
a first waste heat source for providing a first waste fluid having waste heat stored therein; a heat pump having a compressor and a second heat exchanger, wherein the compressor is coupled in line with the first waste heat source and a first side of the second heat exchanger, and wherein the second side of the second heat exchanger is configured to flow the liquid reagent therethrough and into the process chamber.
8 . The system of claim 7 , wherein the first side of the first heat exchanger and the second side of the second heat exchanger are coincident.
9 . A substrate processing system, comprising:
a waste heat source for providing a first waste fluid having waste heat stored therein; a first process chamber having a reagent source coupled thereto and configured to provide a reagent to an inner volume of the first process chamber; and a heat pump coupled between the waste heat source and an incoming reagent line that flows the reagent into the inner volume of the process chamber, the heat pump configured to transfer heat from the waste heat source to the reagent in the incoming reagent line.
10 . The system of claim 9 , further comprising:
a heater disposed in line with the heat pump to further heat the reagent prior to entering the first process chamber.
11 . The system of claim 9 , wherein the waste heat source comprises one or more of a process chamber configured for gaseous processes, a compressed air system, an air separation compressor, an abatement device, electrical equipment or mechanical equipment.
12 . The system of claim 9 , wherein the first process chamber is configured for liquid processes, and wherein the waste heat source comprises a second process chamber configured for gaseous processes and providing the first waste fluid as gaseous exhaust from the second process chamber.
13 . The system of claim 12 , wherein the heat pump further comprises:
a compressor and a first heat exchanger, wherein the compressor is coupled in line with the waste heat source and a first side of the first heat exchanger to pressurize the first waste fluid and prior to the first waste fluid flowing through the first side of the heat exchanger, and wherein a second side of the first heat exchanger is configured to flow the reagent therethrough.
14 . The system of claim 13 , further comprising:
a second heat exchanger having first and second sides configured to transfer heat therebetween, wherein the first side of the second heat exchanger is configured to flow the reagent therethrough and into the first process chamber, and wherein the second side of the second heat exchanger is configured to flow a second waste fluid exhausted from the first process chamber therethrough.
15 . The system of claim 14 , wherein the second side of the first heat exchanger and the first side of the second heat exchanger are coincident.
16 . The system of claim 14 , further comprising:
a heater disposed in line with the second side of the first heat exchanger and the first side of the second heat exchanger to heat the reagent prior to entering the first process chamber.
17 . The system of claim 16 , wherein the heat pump is disposed between the heater and the second heat exchanger.
18 . A method for processing a substrate, comprising:
providing a process chamber configured for liquid processes coupled to a heat exchanger having a first side for flowing a liquid reagent into the processing system and a second side for flowing an effluent from the process chamber; pre-heating the liquid reagent by transferring heat from the effluent flowing through the second side of the heat exchanger to the reagent flowing through the first side of the heat exchanger; and heating the pre-heated liquid reagent to a desired temperature using a heater disposed between the heat exchanger and the process chamber.
19 . The method of claim 18 , wherein pre-heating the liquid reagent further comprises:
flowing the effluent into an intermediate reservoir; and flowing the effluent from the intermediate reservoir to the second side of the heat exchanger.
20 . A method for processing a substrate, comprising:
flowing a liquid reagent through a first side of a heat exchanger to preheat the liquid reagent; heating the pre-heated liquid reagent to a desired temperature using a heater; flowing the heated liquid reagent to a process chamber configured for liquid processes; and flowing a process effluent from the chamber through a second side of the heat exchanger to pre-heat the liquid reagent flowing through the first side of the heat exchanger.
21 . The method of claim 20 , further comprising:
flowing the process effluent into an intermediate reservoir; and flowing the process effluent from the intermediate reservoir to the second side of the heat exchanger.
22 . A method for processing a substrate, comprising:
flowing a reagent through a heat pump coupled to a waste heat source to heat the reagent by transferring heat from the waste heat source to the reagent; and flowing the heated reagent to a process chamber to process the substrate.
23 . The method of claim 22 , wherein the waste heat source comprises one or more of a liquid or gaseous effluent exhausted from a second process chamber, a compressed air system, an air separation compressor, liquid coolant from or a gaseous exhaust from an abatement device, liquid coolant from or hot air from electrical and/or mechanical equipment.
24 . The method of claim 22 , further comprising:
further heating the heated reagent to a desired temperature using a heater disposed between the heat pump and the process chamber.
25 . The method of claim 22 , further comprising
flowing the reagent through a first side of a heat exchanger disposed in line with the heat pump; and flowing an effluent exhausted from the first process chamber through a second side of the heat exchanger to heat the reagent flowing through the first side of the heat exchanger.Join the waitlist — get patent alerts
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