Multilayer printed wiring board for semiconductor devices and method for manufacturing the board

Abstract

A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.

1 . A method for manufacturing a multilayer printed wiring board, comprising:
 preparing a single- or double-sided copper-clad laminate;   forming a conductive film on an upper surface of the copper-clad laminate;   forming a resin layer on the upper surface of the copper-clad laminate;   forming a opening for via-hole in the resin layer,   forming the via-hole in the resin layer;   forming a opening for via-holes in the copper-clad laminate; and   forming the via-hole in the copper-clad,   wherein the via-hole formed in the resin layer is open in the direction opposite to the direction in which the via-hole formed in the copper-clad laminate is open.   
   
   
       2 . The method according to  claim 1 ,
 wherein the via-hole formed in the resin layer taper toward the conductive film, and   the via-hole formed in the copper-clad laminate tapers toward the conductive film.   
   
   
       3 . The method according to  claim 1 , wherein the copper-clad laminate includes a glass fabric impregnated with an epoxy resin. 
   
   
       4 . The method according to  claim 1 , further comprising:
 forming another resin layer on the resin layer;   forming another opening for a via-hole in the another resin layer; and   forming another via-hole in the another resin layer.   
   
   
       5 . The method according to  claim 1 , wherein the via-holes are filled with a conductor by plating process. 
   
   
       6 . The method according to  claim 1 , further comprising:
 attaching a single or double-side copper-clad laminate to each other with an adhesive; and   separating the two copper-clad laminates by melting or softening the adhesive.   
   
   
       7 . A method for manufacturing a multilayer printed wiring board comprising:
 preparing a support plate;   forming a conductive film on the support plate;   forming a first resin layer on the upper surface of the support plate;   forming a first opening for a first via-hole in the first resin layer;   forming the first via-hole in the first resin layer;   forming a second resin layer on the upper surface of the first resin layer;   forming a second opening for a second via-hole in the second resin layer;   forming the second via-hole in the second resin layer;   removing the support plate;   forming a coreless layer on the lower surface of the first resin layer;   forming a third opening for a third via-hole in the coreless layer, and   forming the third via-hole in the coreless layer, wherein   the first opening and the second opening are open in the direction opposite to the direction in which the third opening is open.   
   
   
       8 . The method according to  claim 7 , wherein the via-holes formed in the first and second resin layers broaden upward and taper downward and the via-hole formed in the coreless layer tapers upward and broadens downward. 
   
   
       9 . The method according to  claim 7 , wherein the each via-hole is filled with a conductor by plating process. 
   
   
       10 . The method according to  claim 7 , further comprising:
 attaching two support plates to each other with an adhesive; and   separating the two support plates by melting or softening the adhesive.