Method of manufacture of an identification wristband construction

Abstract

A method of manufacture of a wristband includes the steps of providing a bottom substrate. First circuit elements are deposited on the bottom substrate. A dielectric material is deposited at predetermined areas on the bottom substrate. A remainder of the circuit is deposited on the bottom substrate and dielectric materials. A transponder chip is secured to the bottom substrate to form a transponder. A second substrate is affixed to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and second substrate.

1 . A method of manufacture of a wristband comprising the steps of:
 providing a bottom substrate;   depositing first circuit elements on the bottom substrate;   curing the first circuit elements;   depositing a dielectric material at at least one predetermined area on the bottom substrate;   depositing a remainder of the circuit on the bottom substrate and dielectric material;   securing an RFID integrated circuit chip to the bottom substrate to form a transponder with the first circuit elements and the remainder of the circuit;   affixing a top substrate to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and second substrate.   
     
     
         2 . The method of  claim 1 , further comprising the step of pre-treating the bottom substrate to prevent warping or shrinkage during manufacture. 
     
     
         3 . The method of manufacture of  claim 1 , wherein the first circuit elements are deposited on the bottom substrate by printing a pattern with conductive ink. 
     
     
         4 . The method of  claim 3 , wherein the first circuit elements include elements of an antenna and a disabling wire. 
     
     
         5 . The method of manufacture of  claim 1 , further comprising the step of curing the dielectric material. 
     
     
         6 . The method of manufacture of  claim 1 , wherein said dielectric material forms a bridge for portions of the transponder. 
     
     
         7 . The method of manufacture of  claim 1 , wherein the chip is secured to the bottom substrate by use of one of conductive adhesive, anisotropic conductive adhesive, non-conductive paste, or solder. 
     
     
         8 . The method of manufacture of  claim 1 , wherein the second substrate is fixed to the bottom substrate utilizing a pressure sensitive adhesive. 
     
     
         9 . The method of manufacture of  claim 1 , further comprising the step of installing a snap insert to the bottom and second substrate, and installing a snap retainer in the bottom and second substrate. 
     
     
         10 . The method of manufacture of  claim 1 , further comprising the step of providing stiffeners at preselected portions at either one of said bottom or top substrates. 
     
     
         11 . The method of manufacture of  claim 11  wherein the stiffener is provided at a position overlying at least one of the transponder chip or dielectric material.