Pb-free solder alloy

Abstract

The present invention is provided to prevent the generation of whiskers via a lead (Pb)-free solder alloy. To achieve this objective, the present invention provides a Pb-free solder alloy including tin (Sn) as a first element and either boron (B) or beryllium (Be) as a second element.

1 . A Pb-free solder alloy comprising: tin (Sn) as a first element; and one of boron (B) or beryllium (Be) as a second element. 
   
   
       2 . The Pb-free solder alloy of  claim 1  , wherein the second element of the Pb-free solder alloy is 0.001 to 0.4% by weight of Be and the rest of the Pb-free solder alloy is comprised of the first element and inevitable impurities. 
   
   
       3 . The Pb-free solder alloy of  claim 1  , wherein the second element of the Pb-free solder alloy is 0.003 to 0.5% by weight of B and the rest of the Pb-free solder alloy is comprised of the first element and inevitable impurities. 
   
   
       4 . The Pb-free solder alloy of  claim 1  , further comprising copper (Cu) as a third element. 
   
   
       5 . The Pb-free solder alloy of  claim 4 , wherein the third element is 0.1 to 5.0% by weight. 
   
   
       6 . The Pb-free solder alloy of  claim 4 , wherein the second element of the Pb-free solder alloy is 0.001 to 0.4% by weight of Be and the rest of the Pb-free solder alloy is comprised of the first element, the third element, and inevitable impurities. 
   
   
       7 . The Pb-free solder alloy of  claim 4 , wherein the second element of the Pb-free solder alloy is 0.003 to 0.5% by weight of B and the rest of the Pb-free solder alloy is comprised of the first element, the third element, and inevitable impurities. 
   
   
       8 . The Pb-free solder alloy of  claim 1 , further comprising silver (Ag) as a fourth element. 
   
   
       9 . The Pb-free solder alloy of  claim 8 , wherein the second element of the Pb-free solder alloy is 0.001 to 0.4% by weight of Be and the rest of the Pb-free solder alloy is comprised of one of a group of the first and fourth elements and inevitable impurities and a group of the first, third, and fourth elements and inevitable impurities. 
   
   
       10 . The Pb-free solder alloy of  claim 8 , wherein the second element of the Pb-free solder alloy is 0.003 to 0.5% by weight of B and the rest of the Pb-free solder alloy is comprised of one of a group of the first and fourth elements and inevitable impurities and a group of the first, third, and fourth elements and inevitable impurities. 
   
   
       11 . The Pb-free solder alloy of  claim 5 , wherein the second element of the Pb-free solder alloy is 0.001 to 0.4% by weight of Be and the rest of the Pb-free solder alloy is comprised of the first element, the third element, and inevitable impurities. 
   
   
       12 . The Pb-free solder alloy of  claim 5 , wherein the second element of the Pb-free solder alloy is 0.003 to 0.5% by weight of B and the rest of the Pb-free solder alloy is comprised of the first element, the third element, and inevitable impurities. 
   
   
       13 . The Pb-free solder alloy of  claim 4 , further comprising silver (Ag) as a fourth element. 
   
   
       14 . The Pb-free solder alloy of  claim 13 , wherein the second element of the Pb-free solder alloy is 0.001 to 0.4% by weight of Be and the rest of the Pb-free solder alloy is comprised of one of a group of the first and fourth elements and inevitable impurities and a group of the first, third, and fourth elements and inevitable impurities. 
   
   
       15 . The Pb-free solder alloy of  claim 13 , wherein the second element of the Pb-free solder alloy is 0.003 to 0.5% by weight of B and the rest of the Pb-free solder alloy is comprised of one of a group of the first and fourth elements and inevitable impurities and a group of the first, third, and fourth elements and inevitable impurities.