Liquid-cooling type thermal module
Abstract
A liquid-cooling type thermal module includes a liquid cooling unit and at least one heat pipe. The heat pipe has a heat-absorbing end and a heat-dissipating end. The heat-absorbing end is connected to at least one heat-producing element. The heat-producing element is located inside a system while the liquid cooling unit is located outside the system. The heat pipe connects the heat-producing element to the liquid cooling unit. Heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred to the remote liquid cooling unit via the heat-dissipating end to be dissipated. With the heat pipe being used as a medium for conducting heat, the problem of fluid leak can be eliminated, and the heat produced by the heat-producing element can be effectively carried away from the system without stagnating around the heat-producing element, enabling the thermal module to provide excellent heat dissipating effect.
Claims
exact text as granted — not AI-modified1 . A liquid-cooling type thermal module, comprising a liquid cooling unit and at least one heat pipe; the heat pipe having a heat-absorbing end and a heat-dissipating end, the heat-absorbing end being connected to at least one heat-producing element, and the heat-dissipating end being connected to the liquid cooling unit, whereby heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred by the heat pipe to the liquid cooling unit via the heat-dissipating end to be dissipated.
2 . The liquid-cooling type thermal module as claimed in claim 1 , wherein the heat-producing element is located inside a system while the liquid cooling unit is located outside the system, and the heat pipe is extended into the system to connect the heat-producing element to the liquid cooling unit.
3 . The liquid-cooling type thermal module as claimed in claim 1 , wherein the liquid cooling unit internally defines a dissipating space and includes a pump, a type of fluid being filled in the dissipating space, and the pump driving the fluid to flow in the dissipating space.
4 . The liquid-cooling type thermal module as claimed in claim 1 , wherein at least one cooling fan is mounted to one side of the liquid cooling unit.
5 . The liquid-cooling type thermal module as claimed in claim 1 , wherein the heat-absorbing end has a flat configuration for bearing on the heat-producing element.
6 . The liquid-cooling type thermal module as claimed in claim 1 , wherein the heat-absorbing end is connected to at least one heat sink, and the heat sink is attached to the heat-producing element.
7 . The liquid-cooling type thermal module as claimed in claim 3 , wherein the liquid cooling unit further internally defines at least one flow way in the dissipating space, and the flow way being communicable with the pump.
8 . The liquid-cooling type thermal module as claimed in claim 3 , wherein the heat-dissipating end is inserted into the dissipating space.
9 . The liquid-cooling type thermal module as claimed in claim 1 , wherein the liquid cooling unit includes a plurality of radiating fins protruded from one side of the liquid cooling unit.
10 . The liquid-cooling type thermal module as claimed in claim 2 , wherein the liquid cooling unit internally defines a dissipating space and includes a pump, a type of fluid being filled in the dissipating space, and the pump driving the fluid to flow in the dissipating space.
11 . The liquid-cooling type thermal module as claimed in claim 2 , wherein the system is selected from the group consisting of a case of an electronic device, a telecommunication cabinet, a computer case, and an LED lamp lens.
12 . The liquid-cooling type thermal module as claimed in claim 10 , wherein the liquid cooling unit further internally defines at least one flow way in the dissipating space, and the flow way being communicable with the pump.Join the waitlist — get patent alerts
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