US2010089555A1PendingUtilityA1

Liquid-cooling type thermal module

Assignee: ASIA VITAL COMPONENTS CO LTDPriority: Oct 14, 2008Filed: Oct 24, 2008Published: Apr 15, 2010
Est. expiryOct 14, 2028(~2.2 yrs left)· nominal 20-yr term from priority
Inventors:Chih-Peng Chen
H10W 40/47F28D 15/00F28D 15/0266
46
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Claims

Abstract

A liquid-cooling type thermal module includes a liquid cooling unit and at least one heat pipe. The heat pipe has a heat-absorbing end and a heat-dissipating end. The heat-absorbing end is connected to at least one heat-producing element. The heat-producing element is located inside a system while the liquid cooling unit is located outside the system. The heat pipe connects the heat-producing element to the liquid cooling unit. Heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred to the remote liquid cooling unit via the heat-dissipating end to be dissipated. With the heat pipe being used as a medium for conducting heat, the problem of fluid leak can be eliminated, and the heat produced by the heat-producing element can be effectively carried away from the system without stagnating around the heat-producing element, enabling the thermal module to provide excellent heat dissipating effect.

Claims

exact text as granted — not AI-modified
1 . A liquid-cooling type thermal module, comprising a liquid cooling unit and at least one heat pipe; the heat pipe having a heat-absorbing end and a heat-dissipating end, the heat-absorbing end being connected to at least one heat-producing element, and the heat-dissipating end being connected to the liquid cooling unit, whereby heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred by the heat pipe to the liquid cooling unit via the heat-dissipating end to be dissipated. 
   
   
       2 . The liquid-cooling type thermal module as claimed in  claim 1 , wherein the heat-producing element is located inside a system while the liquid cooling unit is located outside the system, and the heat pipe is extended into the system to connect the heat-producing element to the liquid cooling unit. 
   
   
       3 . The liquid-cooling type thermal module as claimed in  claim 1 , wherein the liquid cooling unit internally defines a dissipating space and includes a pump, a type of fluid being filled in the dissipating space, and the pump driving the fluid to flow in the dissipating space. 
   
   
       4 . The liquid-cooling type thermal module as claimed in  claim 1 , wherein at least one cooling fan is mounted to one side of the liquid cooling unit. 
   
   
       5 . The liquid-cooling type thermal module as claimed in  claim 1 , wherein the heat-absorbing end has a flat configuration for bearing on the heat-producing element. 
   
   
       6 . The liquid-cooling type thermal module as claimed in  claim 1 , wherein the heat-absorbing end is connected to at least one heat sink, and the heat sink is attached to the heat-producing element. 
   
   
       7 . The liquid-cooling type thermal module as claimed in  claim 3 , wherein the liquid cooling unit further internally defines at least one flow way in the dissipating space, and the flow way being communicable with the pump. 
   
   
       8 . The liquid-cooling type thermal module as claimed in  claim 3 , wherein the heat-dissipating end is inserted into the dissipating space. 
   
   
       9 . The liquid-cooling type thermal module as claimed in  claim 1 , wherein the liquid cooling unit includes a plurality of radiating fins protruded from one side of the liquid cooling unit. 
   
   
       10 . The liquid-cooling type thermal module as claimed in  claim 2 , wherein the liquid cooling unit internally defines a dissipating space and includes a pump, a type of fluid being filled in the dissipating space, and the pump driving the fluid to flow in the dissipating space. 
   
   
       11 . The liquid-cooling type thermal module as claimed in  claim 2 , wherein the system is selected from the group consisting of a case of an electronic device, a telecommunication cabinet, a computer case, and an LED lamp lens. 
   
   
       12 . The liquid-cooling type thermal module as claimed in  claim 10 , wherein the liquid cooling unit further internally defines at least one flow way in the dissipating space, and the flow way being communicable with the pump.

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