Lithographic contact elements

Abstract

A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

1 . A method of forming a contact element, comprising:
 successively patterning a plurality of layers of masking material over a substrate, each layer of masking material having an opening;   depositing conductive material after each patterning step to form a contact element having:   a post portion coupled to the substrate and formed in an opening in a first masking material layer,   a beam portion coupled at a first location to the post portion and extending laterally and/or transversely from the post portion and formed in an opening in a second masking material layer, and   removing the plurality of layers of masking material.   
     
     
         2 - 38 . (canceled)