Package-on-package assembly and method

Abstract

A package-on-package (PoP) assembly is provided. The package-on-package (PoP) assembly includes a first integrated circuit package and an anisotropic conductive film (ACF) disposed on a top surface of the first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles. The package-on-package (PoP) assembly also includes a second integrated circuit package disposed on a top surface of the anisotropic conductive film.

1 . A package-on-package (PoP) assembly, comprising:
 a first integrated circuit package including a first substrate;   an anisotropic conductive film (ACF) disposed on a top surface of the first substrate wherein the anisotropic conductive film comprises a plurality of conductive particles; and   a second integrated circuit package disposed on a top surface of the anisotropic conductive film.   
     
     
         2 . The package on package assembly of  claim 1 , wherein the anisotropic conductive film is electrically coupled to the first and second integrated circuit packages. 
     
     
         3 . The package-on-package assembly of  claim 1 , wherein the anisotropic conductive film comprises a polyester film. 
     
     
         4 . The package-on-package assembly of  claim 2 , wherein a thickness of the anisotropic conductive film is between about 20 microns to about 80 microns. 
     
     
         5 . The package-on-package assembly of  claim 1 , wherein the anisotropic conductive film comprises a uniform array of the conductive particles disposed within the anisotropic conductive film. 
     
     
         6 . The package-on-package assembly of  claim 5 , wherein a thickness of each of the conductive particles is about 150 microns. 
     
     
         7 . The package-on-package assembly of  claim 5 , wherein a pitch of the conductive particles is about 100 microns. 
     
     
         8 . The package-on-package assembly of  claim 1 , wherein the first integrated circuit package comprises a plurality of copper pads disposed on the top surface of the first substrate and the second integrated circuit package comprises a solder paste disposed in a plurality of locations on the top surface of the second integrated circuit package. 
     
     
         9 . The package-on-package assembly of  claim 8 , wherein the anisotropic conductive film is disposed between the plurality of copper pads and the corresponding solder paste. 
     
     
         10 . The package-on-package assembly of  claim 1 , further comprising a release liner disposed on a top surface of the anisotropic conductive film. 
     
     
         11 - 15 . (canceled) 
     
     
         16 . A system, comprising:
 a network interface; and   a package-on-package assembly coupled to the network interface, wherein the package-on-package assembly comprises:
 a first integrated circuit package including a first substrate; 
 an anisotropic conductive film (ACF) having a plurality of conductive particles disposed on a top surface of the first substrate; and 
   a second integrated circuit package disposed on a top surface of the anisotropic conductive film.   
     
     
         17 . The system of  claim 16 , wherein the plurality of conductive particles are aligned between a plurality of copper pads disposed on a top surface of the first substrate and a solder paste disposed on corresponding locations on the second integrated circuit package. 
     
     
         18 . The system of  claim 16 , wherein a package form factor of the package-on-package assembly is about 15 millimeters. 
     
     
         19 . The system of  claim 16 , wherein the anisotropic conductive film is to electrically and mechanically couple the first and second integrated circuit packages. 
     
     
         20 . The system of  claim 16 , wherein the anisotropic conductive film comprises a polyester film. 
     
     
         21 . A package-on-package (PoP) assembly, comprising:
 a first integrated circuit package including a first substrate;   an anisotropic conductive film (ACF) disposed on a top surface of the first substrate, wherein the anisotropic conductive film comprises a plurality of conductive particles; and   a second integrated circuit package disposed on a top surface of the anisotropic conductive film, and wherein the anisotropic conductive film is electrically coupled to the first and second integrated circuit packages.   
     
     
         22 . The package-on-package assembly of  claim 21 , wherein the anisotropic conductive film comprises a polyester film, and wherein the plurality of conductive particles includes a shape selected from cylindrical, square, cubical, and round. 
     
     
         23 . The package-on-package assembly of  claim 21 , wherein the plurality of conductive particles includes an objected selected from a polymer coated with gold, a polymer coated with nickel and gold, a gold coated with nickel, and a glass bead coated with silver. 
     
     
         24 . The package-on-package assembly of  claim 21 , wherein a thickness of each of the conductive particles is about 150 microns, and wherein a pitch of the conductive particles is about 100 microns. 
     
     
         25 . The package-on-package assembly of  claim 1 , wherein the first integrated circuit package comprises a plurality of copper pads disposed on the top surface of the first substrate and the second integrated circuit package comprises a solder paste disposed in a plurality of locations on the top surface of the second integrated circuit package, and wherein the anisotropic conductive film is disposed between the plurality of copper pads and the corresponding solder paste.