Method for manufacturing a stamper

Abstract

A method for manufacturing an imprint stamper includes the steps of forming a first electroformed layer on a concavo-convex pattern of an original disk with the pattern, peeling off the first electroformed layer to provide a first stamper, forming a second electroformed layer on a concavo-convex pattern of the first stamper, peeling off the second electroformed layer to provide a second stamper, forming a third electroformed layer on a concavo-convex pattern of the second stamper, and peeling off the third electroformed layer to provide a third stamper. In addition, a conductive film is formed at least on one of a bottom of the concave portion and a top surface of the convex portion of the concavo-convex pattern at least in one of the first stamper and the second stamper.

1 . A method for manufacturing a stamper, comprising the steps of:
 forming a first electroformed layer on a concavo-convex pattern of an original disk;   peeling off the first electroformed layer to provide a first stamper;   forming a second electroformed layer on a concavo-convex pattern of the first stamper;   peeling off the second electroformed layer to provide a second stamper;   forming a third electroformed layer on a concavo-convex pattern of the second stamper; and   peeling off the third electroformed layer to provide a third stamper, wherein   a conductive film is formed on at least one of a bottom of a concave   portion and a top surface of a convex portion of the concavo-convex   pattern in at least one of the first stamper and the second stamper.   
     
     
         2 . The method according to  claim 1 , wherein the conductive film is formed so as to make the conductive film on the top surface of the convex portion thicker than that on the bottom surface of the concave portion. 
     
     
         3 . The method according to  claim 1 , wherein the conductive film is formed on the concavo-convex pattern by a sputtering method. 
     
     
         4 . The method according to  claim 1 , wherein the conductive film is formed on a stamper having the concavo-convex pattern with a track pitch ranging from 10 nm to 100 nm and a sidewall slope ranging from 60° to 100°. 
     
     
         5 . The method according to  claim 1 , wherein the conductive film includes nickel. 
     
     
         6 . The method according to  claim 2 , wherein the conductive film includes nickel. 
     
     
         7 . The method according to  claim 3 , wherein the conductive film includes nickel. 
     
     
         8 . The method according to  claim 4 , wherein the conductive film includes nickel. 
     
     
         9 . A method for manufacturing a stamper comprising the steps of:
 a first step comprising:
 forming a conductive film on a concavo-convex pattern of an original disk; 
 forming an electroformed layer on the conductive film; and 
 peeling off the conductive film and the electroformed layer from the original disk so as to provide a father stamper; 
   a second step comprising:
 forming a releasing layer on a concavo-convex pattern of the father stamper; 
 forming an electroformed layer on the releasing layer; and 
 peeling off the electroformed layer from the father stamper so as to provide a mother stamper; and 
   a third step comprising:
 forming a conductive film on at least one of a bottom surface of a concave portion and a top surface of a convex portion of the concavo-convex pattern in at least the mother stamper; 
 forming a releasing layer on the conductive film, which is followed by forming a electroformed layer thereon; and 
 peeling off the electroformed layer so as to provide a son stamper.