Multi-Layer Electronic Component and Method for Manufacturing the Same, Multi-Layer Piezoelectric Element

Abstract

In order to provide a multi-layer electronic component in which the occurrence of delamination between the ceramic layer and the internal electrode is restricted and a method for manufacturing the same, the multi-layer electronic component of the present invention comprises a stack formed by stacking piezoelectric layers and internal electrodes one on another alternately and a pair of external electrodes formed on two opposing side faces of the stack, wherein the internal electrode consists of a first internal electrode connected to the external electrode formed on one of the two side faces and a second internal electrode located between the first internal electrode and connected to the external electrode formed on the other one of the two side faces, and wherein the internal electrodes and the piezoelectric layers are faced in proximity so that a space between them is 2 μm or less over an area occupying 50% or more of the active region where the first internal electrode and the second internal electrode oppose each other.

1 . A multi-layer electronic component comprising;
 a stack formed by stacking piezoelectric layers and internal electrodes one on another alternately and,   a pair of external electrodes formed on two opposing side faces of the stack,   wherein the internal electrode has a first internal electrode connected to the external electrode formed on one of the two side faces and a second internal electrode located between the first internal electrode and connected to the external electrode formed on the other one of the two side faces, and   wherein the internal electrodes and the piezoelectric layers are faced in proximity so that a space between them is 2 μm or less over an area occupying 50% or more of the active region where the first internal electrode and the second internal electrode oppose each other.   
   
   
       2 . The multi-layer electronic component according to  claim 1 , wherein a change in a degree of orientation of the crystal grains that constitute the piezoelectric layer is within 5%. 
   
   
       3 . The multi-layer electronic component according to  claim 2 , wherein an average grain size of the crystal grains of the piezoelectric layer is 5 μm or less. 
   
   
       4 . The multi-layer electronic component according to  claim 3 , wherein thicknesses of the piezoelectric layers are 200 μm or less. 
   
   
       5 . The multi-layer electronic component according to  claim 1 , wherein thicknesses of the internal electrodes are 5 μm or less. 
   
   
       6 . The multi-layer electronic component according to  claim 1 , the internal electrode including an inorganic component different from the metal which is main component, wherein an average particle size of the inorganic component is smaller than an average grain size of the crystal grains of the piezoelectric layer. 
   
   
       7 - 25 . (canceled)