US2010065963A1PendingUtilityA1
Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
Est. expiryMay 26, 2015(expired)· nominal 20-yr term from priority
H10W 72/5524H10W 72/5522H10W 70/644H10W 74/00H10W 90/754H10W 72/07541H10W 72/07533H10W 72/07532H10W 72/07511H10W 72/07141H10W 72/5525H10W 72/01551H10W 72/00H10W 70/68H10W 90/701B23K 20/004B23K 2101/40
53
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Contact structures for a variety of electronic components can be formed to have primarily elastic properties. The contact structures can be free standing, and can be coupled to a variety of different electronic components such as a probe card assembly, a semiconductor wafer or dies, an interposer, or the like. Tips of the contact structures can have a topology that facilities contact with another electronic component.
Claims
exact text as granted — not AI-modified1 - 357 . (canceled)
358 . Semiconductor device, comprising:
a semiconductor die having a front surface and a back surface; and a plurality of free-standing resilient contact structures mounted to the front surface of the semiconductor die.
359 - 374 . (canceled)Join the waitlist — get patent alerts
Track US2010065963A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.