Electrochemical Fabrication Process Including Process Monitoring, Making Corrective Action Decisions, and Taking Appropriate Actions

Abstract

Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.

1 . An electrochemical fabrication process for batch producing of a plurality of three-dimensional structures from a plurality of adhered layers, the process comprising:
 (A) selectively depositing a first material of a first layer onto the substrate, wherein the substrate may comprise previously deposited material, depositing a second material of the first layer onto the substrate, and planarizing the first and second materials of the first layer to set a boundary level of the first layer;   (B) forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously formed layers, wherein said forming of the plurality of layers comprises repeating the operations of step (A) a plurality of times;   wherein a selective depositing step associated with the forming of a given layer of the plurality of layers, comprises:
 (1) providing a mask having at least one opening to the substrate or to an immediately preceding layer; 
 (2) in presence of a plating solution, conducting an electric current between an anode and the substrate or the immediately preceding layer through the at least one opening in the mask, such that a first material for the given layer is deposited onto the substrate or onto the immediately preceding layer to form a portion of the given layer; and 
 (3) removing the mask from the substrate or previously formed layer; 
   (C) after the forming of the plurality of layers, removing at least one of the deposited materials from a plurality of layers to reveal the three-dimensional structures,   wherein during the forming of the plurality of layers, (i) identifying structures that are considered to have failed, (ii) maintaining a data log of failed structures, (iii) periodically determining if the number of failed structures is excessive, and (iv) if the number of failed structures is considered excessive, removing one or more layers; and (vi) repeating the forming of the one or more layers that had been removed.   
   
   
       2 . The process of  claim 1 , wherein the first material deposited to form each of a plurality of layers and the second material deposited to form each of the plurality of layers comprises at least one structural material and at least one sacrificial material. 
   
   
       3 . The process of  claim 1  wherein the identification is, at least in part based on a visual inspection. 
   
   
       4 . An electrochemical fabrication process for batch producing of a plurality of three-dimensional structures from a plurality of adhered layers, the process comprising:
 (A) selectively depositing a first material of a first layer onto the substrate, wherein the substrate may comprise previously deposited material, depositing a second material of the first layer onto the substrate, and planarizing the first and second materials of the first layer to set a boundary level of the first layer;   (B) forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously formed layers, wherein said forming of the plurality of layers comprises repeating the operations of step (A) a plurality of times;   wherein a selective depositing step associated with the forming of a given layer of the plurality of layers, comprises:
 (1) providing a mask having at least one opening to the substrate or to an immediately preceding layer; 
 (2) in presence of a plating solution, conducting an electric current between an anode and the substrate or the immediately preceding layer through the at least one opening in the mask, such that a first material for the given layer is deposited onto the substrate or onto the immediately preceding layer to form a portion of the given layer; and 
 (3) removing the mask from the substrate; 
   (C) releasing at least a portion of the structures from one of the deposited materials, which is a sacrificial material;   (D) re-embedding the structures in a sacrificial material;   (E) removing at least a portion of the re-embedded structures by planarization; and   (F) removing the three-dimensional structures from the re-embedding sacrificial material to release the three-dimensional structures.   
   
   
       5 . The process of  claim 4 , wherein the first material deposited to form each of a plurality of layers and the second material deposited to form each of the plurality of layers comprises at least one structural material and at least one sacrificial material. 
   
   
       6 . The process of  claim 4  wherein the plurality of selective depositions comprise the deposition of a plurality of different materials. 
   
   
       7 . The process of  claim 4  wherein at least a portion of one layer is formed by a non-electroplating deposition process.