US2010064510A1PendingUtilityA1

Component supply head device and component mounting head device

Assignee: NARITA SHORIKIPriority: May 17, 2004Filed: Nov 27, 2009Published: Mar 18, 2010
Est. expiryMay 17, 2024(expired)· nominal 20-yr term from priority
H10P 72/0442H10P 72/78H10W 72/07178H10W 72/0711H10P 72/0446Y10T29/53174Y10T29/53191Y10T29/49128Y10T29/4913H05K 13/04Y10T29/53178
56
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Claims

Abstract

A suction nozzle ( 65 ) of a reversing head device ( 22 ) has a distal end surface ( 65 a ) with a suction hole ( 65 b ) opened therein, and a suction passage ( 65 c ) communicated with the suction hole ( 65 b ) at one end thereof. A portion of the distal end surface ( 65 a ) outside of the suction hole ( 65 b ) abuts against bumps ( 39 ) of an electronic component ( 12 ). The suction hole ( 65 b ) is opposed with a gap to a portion of a mounting side surface ( 12 a ) where no bumps ( 39 ) are present. A vacuum pump ( 65 ) creates an air flow that flows from the gap between the suction hole ( 65 b ) and the mounting side surface ( 12 a ) into the suction passage ( 65 c ) through the suction hole ( 65 b ). The electronic component ( 12 ) is held at the distal end surface ( 65 a ) by a negative pressure generated by the air flow.

Claims

exact text as granted — not AI-modified
1 . A component supply head device for holding a component at a mounting side surface with protruding electrodes to be mounted on a substrate, and reversing an orientation of the mounting side surface of the component to transfer the component to a component mounting head device so that the component mounting head device mounts the component onto the substrate, comprising:
 a suction nozzle provided with a distal end surface where a suction hole is opened and a suction passage communicated with the suction hole at one end thereof, wherein a portion of the distal end surface outside the suction hole abuts against the protruding electrodes of the component, wherein the suction holes is opposed with a gap to a portion of the mounding side surface on which the protruding electrodes are not provided, and wherein an air flow is generated by vacuum suction force acting from the other end of the suction passage, the air flow flowing from the gap between the suction hole and the mounting side surface into the suction passage through the suction hole and generating a negative pressure to hold the component at the distal end surface.   
   
   
       2 . The component supply head device according to  claim 1 , wherein the suction hole comprises a center section communicated with the suction passage and a plurality of branch sections extending radially from the center section. 
   
   
       3 . The component supply head device according to  claim 1 , wherein an outer dimension of the distal end surface is set so that an outer peripheral edge of the distal end surface is positioned inside a peripheral edge of the component held by the suction nozzle and outside the protruding electrodes. 
   
   
       4 . A component supply apparatus, comprising:
 the component supply head device according to  claim 1 ;   a component disposing section where a plurality of components are disposed so that they can be taken out by the suction nozzle; and   a component supply and accommodation section for accommodating the components so that they can be disposed in the component disposing section.   
   
   
       5 . A component mounting apparatus, comprising:
 the component supply apparatus according to  claim 4 ;   the component mounting head device for releasably holding the component;   a substrate holding section for releasably holding the substrate; and   a alignment device for aligning the substrate held by the substrate holding section and the component held by the component mounting head device.   
   
   
       6 . A component mounting head device for holding a component at a non-mounting side surface opposite to a mounting side surface where a plurality of protruding electrodes are provided, and joining the protruding electrodes to corresponding substrate electrodes formed on a substrate to mount the component on the substrate, comprising:
 a heater for heating the component; and   a suction nozzle comprising a distal end surface where a suction hole is opened and a suction groove communicated with the suction hole is formed in an entire area corresponding to a joining area of the mounting side surface of the component where the protruding electrodes are provided, a proximal end surface opposite to the distal end surface abutting against the heater, and a suction passage communicated with the suction hole at one end thereof, wherein the component is held at the distal end surface by a vacuum suction force acting from the other end of the suction passage.   
   
   
       7 . The component mounting head device according to  claim 6 , wherein the suction groove comprises:
 a closed pattern section disposed along a peripheral edge of the distal end surface;   a plurality of first line sections disposed inside the closed pattern section so as to extend in a first direction and communicated with the closed pattern section at both ends thereof; and   a plurality of second line sections disposed inside the closed pattern so as to extend in a direction crossing the first direction, communicated with the closed pattern section at both ends thereof, and communicated with the first line sections intersecting therewith.   
   
   
       8 . The component mounting head device according to  claim 6 , wherein the suction groove comprises:
 a plurality of first line sections disposed so as to extend in a first direction; and   a plurality of second sections disposed so as to extend in a second direction crossing the first direction and communicated with the first line sections intersecting therewith.   
   
   
       9 . The component mounting head device according to  claim 6 , wherein the suction groove comprises:
 at least one closed pattern section disposed so as to surround a center of the area of the distal end surface corresponding to the joining area; and   a plurality of line sections extending radially from the center of the area of the distal end surface corresponding to the joining area and communicated with the closed pattern section intersecting therewith.   
   
   
       10 . The component mounting head device according to  claim 9 , wherein the suction groove comprises a plurality of the closed pattern sections disposed concentrically with respect to the center of the area of the distal end surface corresponding to the joining area. 
   
   
       11 . The component mounting head device according to  claim 6 , wherein the suction groove has a form of a single continuous line. 
   
   
       12 . The component mounting head device according to  claim 11 , wherein the suction groove has a form of a spiral constituted by joining a plurality of line sections respectively extending in substantially the same directions to respective portions of the peripheral edge of the distal end surface. 
   
   
       13 . The component mounting head device according to  claim 11 , wherein the suction groove has a rectangular wave-like shape comprising alternately connected first straight line sections extending in a first direction and second straight line sections extending in a direction crossing the first direction. 
   
   
       14 . The component mounting head device according to  claim 6 , wherein the suction nozzle further comprises a recess formed in the distal end surface and separated from the suction hole. 
   
   
       15 . The component mounting head device according to  claim 14 , wherein the recess is disposed between the suction groove and the peripheral edge of the distal end surface. 
   
   
       16 . The component mounting head device according to  claim 15 , wherein the recess has a form of a closed pattern. 
   
   
       17 . A component mounting apparatus comprising:
 the component mounting head device according to  claim 6 ;   a component supply apparatus for supplying the component to the component mounting head device;   a substrate holding section for releasably holding the substrate; and   a alignment device for aligning the substrate held by the substrate holding section and the component held by the component mounting head device.

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