Microfeature workpiece substrates having through-substrate vias, and associated methods of formation

Abstract

Microfeature workpiece substrates having through-substrate vias, and associated methods of formation are disclosed. A method in accordance with one embodiment for forming a support substrate for carrying microfeature dies includes exposing a support substrate to an electrolyte, with the support substrate having a first side with a first conductive layer, a second side opposite the first side with a second conductive layer, and a conductive path extending through the support substrate from the first conductive layer to the second conductive layer. The method can further include forming a bond pad at a bond site of the first conductive layer by disposing at least one conductive bond pad material at the bond site, wherein disposing the at least one conductive bond pad material can include passing an electrical current between the first and second conductive layers via the conductive path, while the substrate is exposed to the electrolyte.

1 . A microelectronic system, comprising:
 a support substrate configured to carry a microfeature die, the support substrate having a first surface with a first conductive layer having multiple first bond sites, and a second surface facing opposite from the first surface, the second surface having a second conductive layer with multiple second bond sites;   conductive bond pad material positioned at the first bond sites to form first bond pads, the first bond pads being separated from each other by a first average spacing, the bond pad material extending around an edge of the first conductive layer at the first bond sites;   conductive bond pad material positioned at the second bond sites to form second bond pads, the first and second bond pads being electrically coupled with conductive pathways extending through the support substrate, the second bond pads being separated from each other by a second average spacing greater than the first average spacing, the bond pad material having a different arrangement at the second bond sites than at the first bond sites.   
   
   
       2 . The system of  claim 1  wherein the bond pad material at the second bond sites is spaced apart from an edge of the second conductive layer at the second bond sites. 
   
   
       3 . The system of  claim 1 , further comprising conductive couplers attached to the second bond pad sites. 
   
   
       4 . The system of  claim 1 , further comprising:
 a microfeature die carried by the support substrate and electrically coupled to the first bond pads of the support substrate; and   an external device electrically coupled to the second bond pads of the support substrate.   
   
   
       5 . The system of  claim 1 , further comprising a microfeature die carried by the support substrate and electrically coupled to the first bond pads of the support substrate. 
   
   
       6 . A microelectronic system, comprising:
 a support substrate configured to carry a microfeature die, the support substrate having a first surface with a first conductive layer having multiple first bond sites, and a second surface facing opposite from the first surface, the second surface having a second conductive layer with multiple second bond sites;   conductive bond pad material positioned at the first bond pad sites to form first bond pads, the first bond pads being separated from each other by a first average spacing, the bond pad material extending around an edge of the first conductive layer at the first bond sites;   conductive bond pad material positioned at the second bond pad sites to form second bond pads, the first and second bond pads being electrically coupled with conductive pathways extending through the support substrate, the second bond pads being separated from each other by a second average spacing greater than the first average spacing, the bond pad material being offset laterally from an edge of the of the second conductive layer at the second bond sites;   a first at least generally permanent protective coating positioned adjacent to the first bond pads; and   a second at least generally permanent protective coating positioned on the second surface.   
   
   
       7 . The system of  claim 6 , further comprising conductive couplers attached to the second bond pad sites. 
   
   
       8 . The system of  claim 6 , further comprising:
 a microfeature die carried by the support substrate and electrically coupled to the first bond pads of the support substrate; and   an external device electrically coupled to the second bond pads of the support substrate.   
   
   
       9 . The system of  claim 6 , further comprising a microfeature die carried by the support substrate and electrically coupled to the first bond pads of the support substrate.