Semiconductor processing heat exchanger system

Abstract

A semiconductor fabrication heat exchanger system is provided including two heat exchangers spaced from each other. The first heat exchanger receives a high temperature fluid heated from a semiconductor processing tool or the like and the second heat exchanger has a second fluid with a set temperature significantly lower than the heated fluid of the first heat exchanger. A variable and controllable fan removes heat from the heated fluid and the second heat exchanger cools the heated air.

1 . A semiconductor processing heat exchanger system comprising:
 a first heat exchanger having a first fluid;   a second heat exchanger spaced from the first heat exchanger in a non-contacting relationship with the first heat exchanger, the second heat exchanger having a second fluid, the second fluid having a set temperature significantly lower than the first fluid; and   a fan arranged to transmit air across the first heat exchanger to remove heat from the first fluid and a temperature difference between air transmitted by the fan and first fluid is equal to or greater than about 100 degrees Celsius.   
   
   
       2 . The system of  claim 1  wherein the first fluid has a temperature of about 170 to 190 degrees Celsius prior to entering the first heat exchanger and the second fluid has a temperature of about 15 to 25 degrees Celsius prior to entering the second heat exchanger. 
   
   
       3 . The system of  claim 1  wherein the first heat exchanger has an inlet and an outlet and the first fluid entering the inlet has a temperature higher than the first fluid exiting out the outlet of the first heat exchanger. 
   
   
       4 . The system of  claim 1  further comprising a sensor monitoring the temperature of the first fluid. 
   
   
       5 . The system of  claim 4  wherein the fan changes speed based on the monitored first fluid temperature. 
   
   
       6 . The system of  claim 4  further comprising a controller coupled to the sensor and commanding the fan to change fan speed based on an output from the sensor. 
   
   
       7 . The system of  claim 4  further comprising a controller coupled to the sensor and configured to increase the fan speed when the first fluid temperature is at or above a specific set temperature and to decrease the fan speed when the first fluid temperature is at or below a specific set temperature. 
   
   
       8 . The system of  claim 1  wherein the first liquid is a semiconductor processing fluid and the second liquid is water. 
   
   
       9 . The system of  claim 8  wherein the semiconductor processing fluid consists of GALDEN or FLUORINERT fluid. 
   
   
       10 . The system of  claim 11  further comprising a semiconductor processing tool coupled to the first heat exchanger and in fluid communication with the semiconductor processing fluid. 
   
   
       11 . The system of  claim 1  further comprising a semiconductor processing tool transferring heat to the first fluid and the second heat exchanger removing heat from the air transmitted by the fan. 
   
   
       12 . The system of  claim 1  further comprising an insulated housing enclosing the first and second heat exchangers. 
   
   
       13 . The system of  claim 1  further comprising a duct in which the fan, the first heat exchanger and the second heat exchanger are enclosed. 
   
   
       14 . The system of  claim 1  further comprising a reservoir coupled to the first heat exchanger and a pump circulating the first liquid from the reservoir to the first heat exchanger. 
   
   
       15 . A semiconductor processing heat exchanger system comprising:
 a semiconductor processing tool;   a first heat exchanger having a first fluid being circulated into and out of the first heat exchanger and to and from the semiconductor processing tool;   a second heat exchanger spaced from the first heat exchanger in a non-contacting relationship with the first heat exchanger and separately contained from that of the first heat exchanger, the second heat exchanger having a second fluid, the second fluid having a set temperature significantly lower than the first fluid; and   a variable speed fan aligned with the first and second heat exchangers and arranged to transmit air across the first and second heat exchangers, a temperature of the air prior to transmission across the first heat exchanger being significantly lower than a temperature of the first fluid and the temperature of the air after transmission across the first heat exchanger being significantly higher than a temperature of the second fluid.   
   
   
       16 . The system of  claim 15  further comprising a controller configured to turn on and off the fan and to adjust fan speed of the fan based on the temperature of the first fluid. 
   
   
       17 . The system of  claim 16  wherein a temperature difference between air transmitted by the fan and first fluid is about 120 to 160 degrees Celsius. 
   
   
       18 . The system of  claim 17  further comprising:
 a reservoir coupled to the first heat exchanger;   a pump coupled to the reservoir arranged to circulate the first fluid from the reservoir to the semiconductor processing tool; and   a sensor coupled to the first heat exchanger and the controller and measuring temperature of the first fluid exiting the first heat exchanger.   
   
   
       19 . A method of exchanging heat for a semiconductor fabrication system, the method comprising:
 heating a first fluid by a semiconductor processing tool;   receiving the heated first liquid by a first heat exchanger;   transmitting air across the first heat exchanger by a fan, the transmitted air having a temperature significantly higher than the heated first fluid;   receiving water by the second heat exchanger, the water having a temperature significantly lower than the heated first fluid;   spacing the first heat exchanger from the second heat exchanger; and   transmitting air across the second heat exchanger by the fan.   
   
   
       20 . The method of  claim 19  further comprising adjusting speed of the fan based on the first fluid's temperature exiting the first heat exchanger.