US2010051073A1PendingUtilityA1

Cleaning method and a cleaning device for cleaning an edge portion and back face of a wafer

Assignee: TOSHIBA KKPriority: Jun 1, 2005Filed: Nov 4, 2009Published: Mar 4, 2010
Est. expiryJun 1, 2025(expired)· nominal 20-yr term from priority
H10P 74/203H10P 72/0414H10P 70/54Y10S134/902
55
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Claims

Abstract

A method for cleaning a wafer includes measuring a cross-sectional shape of an edge portion of wafer cut along a radial direction, assigning the measured shape to one of a plurality of groups classified by the shapes, determining an amount of cleaning liquid to be supplied and rotational speed at which the wafer is rotated depending a determination criterion, rotating the wafer and spraying the cleaning liquid toward a back face of the rotating wafer, and cleaning the edge portion and the back face of the wafer by spreading the cleaning liquid to the edge portion of the wafer.

Claims

exact text as granted — not AI-modified
1 .- 10 . (canceled) 
   
   
       11 . A cleaning device comprising:
 a stage provided to rotate a disk-shaped wafer;   a measurement unit to measure at least one of a cross-sectional shape of an edge portion of the wafer and a wettability of the edge portion of the wafer;   a determination unit, by assigning at least one of the measured shape and the wettability to one of the corresponding groups classified by the shape or the wettability, to determine an amount of cleaning liquid to be supplied and a rotational speed at which the wafer is rotated, based on determination criteria including the classifications by the shape and the wettability; and   a cleaning liquid supply unit to supply on amount of cleaning liquid to a back face of the wafer.   
   
   
       12 . The cleaning device of  claim 11 , further comprising a front-side supply unit to blow gas to a front face of the wafer. 
   
   
       13 . The cleaning device of  claim 11 , further comprising a shutter provided between the measurement unit and the wafer. 
   
   
       14 . The cleaning device of  claim 11 , wherein the stage is provided with a vacuum chuck. 
   
   
       15 . The cleaning device of  claim 11 , wherein the measurement unit is an image sensor. 
   
   
       16 . The cleaning device of  claim 11 , wherein the measurement unit is an acoustic array sensor. 
   
   
       17 . The cleaning device of  claim 11 , wherein the cleaning liquid supply unit supplies an organic solvent. 
   
   
       18 . The cleaning device of  claim 11 , wherein the cleaning liquid supply unit supplies a rinse liquid. 
   
   
       19 . The cleaning device of  claim 11 , wherein the cleaning liquid supply unit supplies a cleaning chemical solution.

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