Vacuum pump
Abstract
A vacuum pump ( 10 ) has a vacuum-tight housing ( 12 ) and having a gas-tight electrical leadthrough assembly ( 20 ) for producing an electrical connection between an electrical component ( 14,16,18 ) within the housing ( 12 ) and the exterior of the housing. The leadthrough assembly ( 20 ) is formed by a housing opening ( 22 ), by a sealing compound body ( 24 ) seated on the opening, by an electric line in the sealing compound body ( 24 ), by a sealing ring ( 26 ) between the opening edge of the housing opening ( 22 ) and the sealing compound body ( 24 ), and by a fixing means ( 32 ) for fastening the sealing compound body ( 24 ) to the housing ( 12 ).
Claims
exact text as granted — not AI-modified1 . A vacuum pump comprising
a vacuum-tight housing, an elastic component arranged within said housing, a gas-tight electrical leadthrough assembly for producing an electrical connection between an electrical component within the housing and the exterior of the housing, wherein said leadthrough assembly is formed by a housing opening, a sealing compound body positioned on said housing opening and enclosing an electric line extending between the interior of the housing and the exterior of the housing, a sealing ring between an opening edge of the housing opening and the sealing compound body, and a fixing means for attachment of the sealing compound body to the housing.
2 . The vacuum pump according to claim 1 , wherein said sealing compound body is mounted to said housing opening from the outside.
3 . The vacuum pump according to claim 1 , wherein said fixing means is a sealing-compound housing.
4 . The vacuum pump according to claim 1 , wherein said electric line comprises a circuit board arranged within the sealing compound body.
5 . The vacuum pump according to claim 1 , wherein said electric line comprises respectively one electric plug towards the interior and towards the exterior.
6 . The vacuum pump according to claim 4 , wherein said circuit board comprises electronic components.
7 . The vacuum pump according to claim 6 , wherein one of said electronic components is configured as a readable pump-data memory.
8 . The vacuum pump according to claim 1 , wherein the material of the sealing compound body is an epoxy resin.Join the waitlist — get patent alerts
Track US2010047095A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.