Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board

Abstract

A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention. The circuit board adopts the impedance controlled mechanism which has a shielding function and an impedance controlled function to replace a via hole on the existing circuit board where the via hole has an uncontrollable resistance.

1 . A circuit board interconnection system, characterized in comprising, a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector;
 wherein the first connector and the second connector are mounted at two sides of the first circuit board, respectively;   the second circuit board is mounted on the first connector;   the third circuit board is mounted on the second connector;   the first connector and the second connector mounted respectively at the two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board.   
   
   
       2 . The system of  claim 1 , characterized in that, the impedance controlled mechanism comprises a metallic conductor, a dielectric layer covering outer surface of the metallic conductor, and a metallized via hole on the first circuit board;
 wherein the metallic conductor covered with the dielectric layer is inserted in the metallized via hole on the first circuit board.   
   
   
       3 . The system of  claim 1 , characterized in that, the impedance controlled mechanism comprises a metallized via hole on the first circuit board, a dielectric layer on inner wall of the metallized via hole, and conductive material covered by the dielectric layer or a metallized layer on inner surface of the dielectric layer. 
   
   
       4 . The system of  claim 2 , characterized in that,
 the second circuit board is perpendicular to the third circuit board;   the impedance controlled mechanisms on the first circuit board are arranged in diagonal symmetry.   
   
   
       5 . The system of  claim 1 , characterized in that, the first connector and/or the second connector is coupled to the impedance controlled mechanism via a press-fitted pin mechanism. 
   
   
       6 . The system of  claim 1 , characterized in that, the first connector and/or the second connector is coupled to a surface-mount signal pin surface-mounted on the impedance controlled mechanism. 
   
   
       7 . The system of  claim 1 , characterized in that, the first circuit board has a through hole at a position where the first connector and/or the second connector is mounted thereon;
 the impedance controlled mechanism comprises a hollow penetrating pin which can be inserted into the through hole and a penetrating pin which can be inserted into the hollow penetrating pin;   the hollow penetrating pin is in a hollow structure made from metal material and the inner wall of the hollow penetrating pin is provided with a dielectric layer;   the penetrating pin is a metallic conductor;   the hollow penetrating pin is located on the first connector at one side of the first circuit board;   the penetrating pin is located on the second connector at the other side of the first circuit board.   
   
   
       8 . The system of  claim 7 , characterized in that, the inner surface of the dielectric layer of the hollow penetrating pin is provided with a metallic conductor layer. 
   
   
       9 . The system of  claim 5 , characterized in that, the system further comprises at least two transceivers and a cable connecting the two transceivers;
 the two transceivers are mounted on the second circuit board and the third circuit board, respectively.   
   
   
       10 . The system of  claim 9 , characterized in that, the system further comprises a cable connector;
 the transceiver and the first connector are located at one side of the second circuit board and the cable connector is located at the other side of the second circuit board;   two ends of the cable are coupled to two cable connectors respectively;   on the second circuit board, there is further provided with at least two via holes coupled to the transceivers or an impedance controlled mechanism coupled to the transceivers;   each cable connector is press-fitted into the via hole coupled to the second circuit board and the transceivers via a press-fit pin; or each cable connector is surface-mounted on the impedance controlled mechanism coupled to the second circuit board and the transceivers;   the first connector is press-fitted by a press-fit pin into a same via hole in which the cable connector on the second circuit board is press-fitted; or the first connector is surface-mounted on a same impedance controlled mechanism on which the transceiver on the second circuit board is surface-mounted.   
   
   
       11 . The system of  claim 9 , characterized in that, the system further comprises cable connectors;
 wherein the transceivers, the first connector and the cable connectors are located at one side of the second circuit board;   two ends of the cable are coupled to two cable connectors respectively;   the transceivers are in a surface-mount packaging structure;   the cable connector coupled to one end of the cable is coupled to a pad of a pin of the transceiver via a microstrip or the cable connector coupled to one end of the cable is surface-mounted on the top of the transceiver and directly coupled to the pin of the transceiver;   the cable connector coupled to the other end of the cable is surface-mounted on the first connector.   
   
   
       12 . The system of  claim 9 , characterized in that, the cable is buried in the second circuit board;
 the transceiver and the first connector are surface-mounted at one side of the second circuit board;   one end of the cable coupled to the transceiver by directly coupling to the bottom of the pad of the pin of the transceiver;   the other end of the cable is coupled to a side of the second circuit board where the first connector is surface-mounted thereon.   
   
   
       13 . The system of  claim 1 , characterized in that, the first circuit board is a backplane. 
   
   
       14 . A circuit board interconnection system, comprising a first circuit board, a connector mounted on the first circuit board, and a second circuit board coupled to the first circuit board via the connector; the system characterized in that,
 the first circuit board comprises an impedance controlled mechanism thereon, wherein the impedance controlled mechanism is electrically coupled to the connector and the second circuit board is electrically coupled to the first circuit board via the connector and the impedance controlled mechanism.   
   
   
       15 . The system of  claim 14 , characterized in that, the first circuit board comprises a signal layer, wherein the second circuit board is coupled to the signal layer of the first circuit board via the connector and the impedance controlled mechanism. 
   
   
       16 . The system of  claim 14 , characterized in that, the impedance controlled mechanism comprises a metallic conductor, a dielectric layer covering the outer surface of the metallic conductor, and a metallized via hole on the first circuit board;
 wherein the metallic conductor covered with the dielectric layer is inserted in the metallized via hole on the first circuit board.   
   
   
       17 . The system of  claim 14 , characterized in that, the impedance controlled mechanism comprises a metallized via hole on the first circuit board, a dielectric layer on the inner wall of the metallized via hole, and conductive material covered by the dielectric layer or a metallized layer on the inner surface of the dielectric layer. 
   
   
       18 . A circuit board, characterized in that, an impedance controlled mechanism is provided at a position where a connector is mounted the circuit board. 
   
   
       19 . The circuit board of  claim 18 , characterized in that, the impedance controlled mechanism comprises a metallic conductor, a dielectric layer covering the outer surface of the metallic conductor, and a metallized via hole on the circuit board;
 wherein the metallic conductor covered with the dielectric layer is inserted in the metallized via hole on the circuit board.   
   
   
       20 . The circuit board of  claim 18 , characterized in that, the impedance controlled mechanism comprises a metallized via hole on the circuit board, a dielectric layer on the inner wall of the metallized via hole, and conductive material covered by the dielectric layer or a metallized layer on the inner surface of the dielectric layer. 
   
   
       21 . A connector assembly, comprising a first connector and a second connector, characterized in that, the connector assembly comprises an impedance controlled mechanism, the impedance controlled mechanism comprises:
 a hollow penetrating pin provided on the first connector, wherein the hollow penetrating pin is in hollow structure made from metal material and the inner wall of the hollow penetrating pin is provided with a dielectric layer;   a penetrating pin provided on the second connector, wherein the penetrating pin is a metallic conductor for inserting into the hollow penetrating pin.   
   
   
       22 . The connector assembly of  claim 18 , characterized in that, the inner surface of the dielectric layer of the hollow penetrating pin is covered with a metallic conductor layer for contacting the inserted penetrating pin. 
   
   
       23 . An impedance controlled mechanism, characterized in that, the impedance controlled mechanism is applied to a circuit board, the impedance controlled mechanism comprises a metallic conductor, a dielectric layer covering the outer surface of the metallic conductor, and a metal shielding layer covering the outer surface of the dielectric layer. 
   
   
       24 . A communication device, comprising a circuit board interconnection system, the circuit board interconnection system is characterized in comprising a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector;
 wherein the first connector and the second connector are mounted at two sides of the first circuit board, respectively;   the second circuit board is mounted on the first connector;   the third circuit board is mounted on the second connector;   the first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board.   
   
   
       25 . The communication device of  claim 24 , characterized in that, the impedance controlled mechanism comprises a metallic conductor, a dielectric layer covering the outer surface of the metallic conductor, and a metallized via hole on the first circuit board;
 wherein the metallic conductor covered with the dielectric layer is inserted in the metallized via hole on the first circuit board.   
   
   
       26 . The communication device of  claim 24 , characterized in that, the impedance controlled mechanism comprises a metallized via hole on the first circuit board, a dielectric layer on the inner wall of the metallized via hole, and conductive material covered by the dielectric layer or a metallized layer on the inner surface of the dielectric layer. 
   
   
       27 . A method for manufacturing a circuit board, characterized in comprising:
 mounting an impedance controlled mechanism on the circuit board, wherein the impedance controlled mechanism is configured to couple connectors mounted at two sides of the circuit board.   
   
   
       28 . The method of  claim 27 , characterized in that, the mounting the impedance controlled mechanism comprises:
 manufacturing a metallized via hole on the circuit board;   pressing a metallic conductor with dielectric into the metallized via hole;   cutting, with a metal cutting tool, a portion of the impedance controlled mechanism which protrudes out of the surface of the circuit board along a direction parallel to the surface of the circuit board.   
   
   
       29 . The method of  claim 27 , characterized in that, the mounting the impedance controlled mechanism comprises:
 manufacturing a metallized via hole on the circuit board;   injecting insulated material into the metallized via hole;   manufacturing a non-metallized via hole in the insulated material;   injecting conductive material into the non-metallized via hole or metalizing the non-metallized via hole by electroplating.