Workpiece processing method

Abstract

A method of processing a workpiece having a plurality of multi-crystal silicon columns embedded in single-crystal silicon includes a grinding step for grinding only the single-crystal silicon by use of a grinding tool and an abrasive step for concurrently polishing the single-crystal silicon and the multi-crystal silicon columns by use of an abrasive tool in a dry manner to expose all the heads of the multi-crystal silicon columns to the front surface of the single-crystal silicon.

1 . A method of processing a workpiece having a plurality of multi-crystal silicon columns embedded in single-crystal silicon, comprising:
 an abrasive step of polishing the single-crystal silicon and the multi-crystal silicon columns by use of an abrasive tool in a dry manner to expose all heads of the multi-crystal silicon columns to a front surface the single-crystal silicon.   
   
   
       2 . The method according to  claim 1 , further comprising:
 a grinding step of grinding the single-crystal silicon by use of a grinding tool before the abrasive step.