US2010041177A1PendingUtilityA1

Controlled growth of larger heterojunction interface area for organic photosensitive devices

Assignee: UNIV PRINCETONPriority: Jul 11, 2006Filed: Oct 16, 2009Published: Feb 18, 2010
Est. expiryJul 11, 2026(expired)· nominal 20-yr term from priority
H10K 30/211H10K 71/16H10K 30/30Y02E10/549Y02P70/50H10K 30/57
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Claims

Abstract

An optoelectronic device and a method of fabricating a photosensitive optoelectronic device includes depositing a first organic semiconductor material on a first electrode to form a continuous first layer having protrusions, a side of the first layer opposite the first electrode having a surface area at least three times greater than an underlying lateral cross-sectional area; depositing a second organic semiconductor material directly on the first layer to form a discontinuous second layer, portions of the first layer remaining exposed; depositing a third organic semiconductor material directly on the second layer to form a discontinuous third layer, portions of at least the second layer remaining exposed; depositing a fourth organic semiconductor material on the third layer to form a continuous fourth layer, filling any exposed gaps and recesses in the first, second, and third layers; and depositing a second electrode on the fourth layer, wherein at least one of the first electrode and the second electrode is transparent, and the first and third organic semiconductor materials are both of a donor-type or an acceptor-type relative to second and fourth organic semiconductor materials, which are of the other material type.

Claims

exact text as granted — not AI-modified
1 . A method of fabricating a photosensitive optoelectronic device, comprising:
 depositing a first organic semiconductor material on a first electrode to form a continuous first layer having protrusions, a side of the first layer opposite the first electrode having a surface area at least three times greater than an underlying lateral cross-sectional area;   depositing a second organic semiconductor material directly on the first layer to form a discontinuous second layer, portions of the first layer remaining exposed;   depositing a third organic semiconductor material directly on the second layer to form a discontinuous third layer, portions of at least the second layer remaining exposed;   depositing a fourth organic semiconductor material on the third layer to form a continuous fourth layer, filling any exposed gaps and recesses in the first, second, and third layers; and   depositing a second electrode on the fourth layer,   wherein at least one of the first electrode and the second electrode is transparent, and   the first and third organic semiconductor materials are both of a donor-type or an acceptor-type relative to second and fourth organic semiconductor materials, which are of the other material type.   
     
     
         2 .- 24 . (canceled)

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