Method of plating a wafer

Abstract

A plating method for forming a uniform magnetic film in conducting a plating treatment on a wafer with a magnetic film of, for instance, a Fe—Co-based alloy. Specifically, the method comprises the steps of supplying a plating solution through a plating-solution-supply section of a plating tank to a wafer, which placed on an opening of the plating tank, and conducting a plating treatment on the wafer while the plating solution is kept in contact with a plating target surface of the wafer, wherein the plating solution employed is one forming a magnetic film, and the plating treatment is done while a magnetic field is applied to the plating solution in contact with the plating target surface of the wafer.

1 . A method of plating a wafer comprising the steps of supplying a plating solution through a plating-solution-supply section of a plating tank to a wafer, which wafer is placed on an opening of the plating tank, and conducting a plating treating on the wafer while the plating solution is kept in contact with a plating target surface of the wafer, wherein said plating solution employed is one forming a magnetic film, and said plating treatment is done while a magnetic field is applied to the plating solution in contact with the plating target surface of the wafer. 
   
   
       2 . The method of plating a wafer according to  claim 1 , wherein the step of applying a magnetic field is conducted by arranging at least one magnetic body on an opposite surface of the plating target surface of the wafer. 
   
   
       3 . The method of plating a wafer according to  claim 1 , wherein said magnetic film is either a Fe—Ni-based alloy or a Fe—Co-based alloy. 
   
   
       4 . The method of plating a wafer according to  claim 2 , wherein said magnetic film is either a Fe—Ni-based alloy or a Fe—Co-based alloy.