Method of and apparatus for detaching semiconductor chips from a tape

Abstract

An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

1 . A method of detaching a semiconductor chip from a tape, comprising:
 placing the tape against a holder with the semiconductor chip facing away from the holder;   subsequently firstly moving the semiconductor chip off of the holder by extending at least a first ejector out of the holder against a portion of the tape to which the semiconductor chip is directly attached, while holding a portion of the tape surrounding the semiconductor chip against the holder to thereby detach a portion of the tape from the chip;   subsequently secondly moving the semiconductor chip further away from the holder by extending a second ejector out of the holder beyond the first ejector and against a portion of the tape to which the semiconductor chip is directly attached, while continuing to hold the portion of the tape surrounding the semiconductor chip against the holder to thereby further detach the tape from the chip; and   subsequently completely separating the semiconductor chip from the tape while holding the chip.   
   
   
       2 . The method of  claim 1 , wherein the separating of the semiconductor chip completely from the tape comprises holding the semiconductor chip with a collet positioned across from the holder. 
   
   
       3 . The method of  claim 1 , wherein the first and second ejectors are juxtaposed with the peripheral and central portions of the semiconductor chip, respectively, such that the semiconductor chip is firstly moved off of the holder while the peripheral portion of the chip is supported, and the semiconductor chip is secondly moved further away from the holder while only the central portion of the chip is supported. 
   
   
       4 . The method of  claim 3 , wherein the moving of the semiconductor chip firstly off of the holder also comprises extending the second ejector from the holder along with the first ejector. 
   
   
       5 . The method of  claim 4 , wherein the separating of the semiconductor chip completely from the tape comprises holding the semiconductor chip with a collet, positioned across from the holder, while retracting the second of the ejectors back towards the holder. 
   
   
       6 . The method of  claim 1 , further comprising exerting suction on a side of the tape that faces the holder over at least a portion of the tape to which the semiconductor chip is directly attached before the ejectors are extended from the holder so as to partially detach the tape from the chip before the chip is moved by the ejectors off of the holder. 
   
   
       7 . The method of  claim 6 , wherein the exerting suction on the tape so as to partially detach the tape from the semiconductor chip comprises exerting suction over a portion of the tape to which the peripheral portion of the semiconductor chip is directly attached. 
   
   
       8 . The method of  claim 6 , wherein the exerting suction on the tape so as to partially detach the tape from the semiconductor chip comprises exerting suction over a portion of the tape to which both the peripheral and central portions of the semiconductor chip are directly attached. 
   
   
       9 . The method of  claim 8 , wherein the moving of the semiconductor chip firstly and secondly off of the holder while holding a portion of the tape surrounding the semiconductor chip against the holder comprises exerting suction on the portion of the tape surrounding the semiconductor chip. 
   
   
       10 . A method of detaching a semiconductor chip from a tape, comprising:
 placing the tape against a holder with the semiconductor chip facing away from the holder;   subsequently firstly moving the semiconductor chip off of the holder by exerting a force on the semiconductor chip across a first region thereof, while holding a portion of the tape surrounding the semiconductor chip against the holder to thereby detach a portion of the tape from the chip;   subsequently secondly moving the semiconductor chip further off of the holder by exerting a force on the semiconductor chip across only a second region thereof smaller than the first region, while continuing to hold the portion of the tape surrounding the semiconductor chip against the holder to thereby further detach the tape from the chip; and   subsequently completely separating the semiconductor chip from the tape while holding the chip.   
   
   
       11 . The method according to  claim 10 , further comprising exerting suction on a side of the tape that faces the holder over at least a portion of the tape to which the semiconductor chip is directly attached, before the semiconductor chip is firstly moved off of the holder so as to partially detach the tape from the chip before the chip is moved off of the holder. 
   
   
       12 . The method of  claim 11 , wherein the separating of the semiconductor chip completely from the tape comprises holding the semiconductor chip with a collet positioned across from the holder.