US2010033607A1PendingUtilityA1

Solid state imaging device and method for manufacturing the same

Assignee: PANASONIC CORPPriority: Nov 18, 2005Filed: Oct 15, 2009Published: Feb 11, 2010
Est. expiryNov 18, 2025(expired)· nominal 20-yr term from priority
H10F 39/805H10F 39/802H10F 39/8063
62
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Claims

Abstract

A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.

Claims

exact text as granted — not AI-modified
1 - 11 . (canceled) 
   
   
       12 . A solid state imaging device comprising:
 a light receiving element formed on a semiconductor substrate;   a microlens formed on the light receiving element;   a first transparent layer formed on the microlens;   a second transparent layer formed on the first transparent layer; and   a third transparent layer formed on the second transparent layer, wherein   a top surface of the first transparent layer is flat,   the first transparent layer has a refractive index lower than a refractive index of the microlens, and   second transparent layer is harder than the first transparent layer.   
   
   
       13 . The solid state imaging device of  claim 12  further comprising:
 a color filter formed on the light receiving element and under the microlens.   
   
   
       14 . The solid state imaging device of  claim 12  further comprising:
 a fourth transparent layer formed on the second transparent layer and under the third transparent layer.   
   
   
       15 . The solid state imaging device of  claim 14 , wherein the fourth transparent layer is made of an epoxy adhesive. 
   
   
       16 . The solid state imaging device of  claim 14 , wherein the fourth transparent layer is made of an acrylic adhesive. 
   
   
       17 . The solid state imaging device of  claim 14 , wherein the fourth transparent layer has a refractive index of 1.5 or more and 1.6 or less. 
   
   
       18 . The solid state imaging device of  claim 12 , wherein the first transparent layer is made of a fluorine-containing resin. 
   
   
       19 . The solid state imaging device of  claim 12 , wherein the first transparent layer has a refractive index of 1.3 or more and 1.5 or less. 
   
   
       20 . The solid state imaging device of  claim 12 , wherein
 the second transparent layer is made of material which is more hydrophilic than the first transparent layer.   
   
   
       21 . The solid state imaging device of  claim 12 , wherein the second transparent layer has a refractive index of 1.3 or more and 1.6 or less. 
   
   
       22 . The solid state imaging device of  claim 12 , wherein the second transparent layer is made of a resin containing no fluorine in its molecular structure.

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