Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.

1 . An array of cantilever probes for making contact with an electronic circuit element, comprising:
 a plurality of independent cantilever probes, each having a base portion, a support functionally connected to the base portion, a cantilever portion functionally connected to the support, and a contact portion functionally connected to the cantilever portion for making contact with the electronic circuit element;   a substrate containing at least two bonding location for each of the plurality of cantilever probes; and   a bonding material functionally attaching base portions of the cantilever probes to their respective bonding locations on said substrate,   wherein for at least a plurality of pairs of first and second cantilever probes, an opening is provided in a base of the first probe between the at least two bonding locations such that the opening provides a space for bonding for the second probe to be used in bonding the second probe to the substrate without the bonding material for the second probe shorting to the base of first probe whereby interlaced bonding locations for a plurality of probes are provide.   
   
   
       2 . A probe mounted to a substrate for testing semiconductor devices, comprising:
 (a) a substrate;   (b) a mounting element mounted to the substrate;   (c) a probe element comprising a body portion, having a distal end connected to a tip portion, and a proximal end connected to a base portion;   wherein the base portion and the mounting element have at least some substantially complementary elements which allow aligned and retained mating of the probe to the mount.   
   
   
       3 . The probe of  claim 2  wherein the probe and mounting element are engaged with one another through at least two non-parallel motions. 
   
   
       4 . The probe of  claim 3  wherein the components are not parallel to the X or Y axes. 
   
   
       5 . The probe of  claim 3  wherein the components are parallel to the X and Y axes. 
   
   
       6 . The probe of  claim 3  wherein at least one of the motions comprises a rotation about an axis parallel to a plane of the substrate. 
   
   
       7 . The probe of  claim 3  wherein at least one of the motions comprises a rotation about an axis that is perpendicular to a plane of the substrate 
   
   
       8 . The probe of  claim 3  wherein either the mount or the probe includes a compliant element that engages the other of the probe or mount when the positioning of the mount and the probe place that in a desired relationship. 
   
   
       9 . The probe of  claim 3  wherein either the mount or the probe includes a plurality of compliant fingers that ensure interlocking of the probe and the mount.