cooling system utilizing carbon nanotubes for cooling of electrical systems

Abstract

A cooling system to cool the airflow through a electrical system includes a CNT heat exchanger module disposed within a housing of the electrical system, a cooling device configured to receive a coolant, a unit board disposed within the housing of the electrical system, and an air flow device configured to pass air across at least a portion of the unit board and at least a portion of the CNT heat exchanger module. The CNT heat exchanger module includes a member having a hole defined therethrough and a plurality of carbon nanotubes (CNTs) attached to the member. The coolant is propagated through the hole in the member so as to dissipate the heat generated by the electrical system.

1 . A cooling system to cool the airflow through a electrical system, comprising:
 a CNT heat exchanger module disposed within a housing of the electrical system, the CNT heat exchanger module comprising:
 a member having a hole defined therethrough; and 
 a plurality of carbon nanotubes (CNTs) disposed on the member; 
   a cooling device disposed within the housing of the electrical system and configured to receive a coolant, wherein the coolant is propagated through the hole in the member so as to dissipate the heat generated by the electrical system;   a unit board disposed within the housing of the electrical system; and   an air flow device configured to pass air across at least a portion of the unit board and at least a portion of the CNT heat exchanger module.   
   
   
       2 . The cooling system of  claim 1 , wherein the CNT heat exchanger module further comprises a porous material that encloses at least a portion thereof. 
   
   
       3 . The cooling system of  claim 1 , wherein at least one of the plurality of CNTs is attached to the member. 
   
   
       4 . The cooling system of  claim 1 , wherein at least one of the plurality of CNTs is monolithically formed with the member. 
   
   
       5 . The cooling system of  claim 1 , wherein the electrical system is a computer server. 
   
   
       6 . The cooling system of  claim 1 , wherein the CNT heat exchanger module is fluidly connected to the cooling device. 
   
   
       7 . The cooling system of  claim 1 , wherein the coolant is at least one of a liquid and a gas for cooling. 
   
   
       8 . The cooling system of  claim 1 , wherein the CNT heat exchanger module comprises a plurality of CNT heat exchanger modules, wherein each of the plurality of CNT heat exchanger modules are fluidly connected to the cooling device. 
   
   
       9 . The cooling system of  claim 1 , wherein the CNT heat exchanger module is removably attached to a cooling device. 
   
   
       10 . The cooling system of  claim 1 , wherein the cooling device comprises one of a pumped liquid system and a refrigeration system. 
   
   
       11 . The cooling system of  claim 1 , wherein a cross-section of the member comprises one of a circular shape, an oval shape, a rectangular shape, a square shape, and a triangular shape. 
   
   
       12 . The cooling system of  claim 1 , wherein the member comprises at least one of a metal, a polymer, a plastic, an epoxy, and a CNT. 
   
   
       13 . The cooling system of  claim 1 , wherein the CNT heat exchanger module further comprising:
 a second member having a hole defined therethrough with a plurality of CNTs attached thereto;   wherein porous material is disposed about at least a portion of the second member.   
   
   
       14 . The cooling system of  claim 1 , wherein at least one of the plurality of CNTs comprises one of a single-walled CNT and a multi-walled CNT. 
   
   
       15 . The cooling system of  claim 1 , wherein at least one of the plurality of CNTs comprises one of an armchair structure, a zigzag structure, and a chiral structure. 
   
   
       16 . The cooling system of  claim 1 , wherein the CNTs are attached to one of at least an inner surface and an outer surface of the member. 
   
   
       17 . The cooling system of  claim 1 , further comprising:
 an internal member having a hole defined therethrough;   wherein the internal member is disposed within the first member.   
   
   
       18 . The cooling system of  claim 17 , wherein the internal member comprises a plurality of CNTs attached thereto. 
   
   
       19 . A cooling apparatus for cooling an electrical system comprising:
 a member having a hole defined therethrough disposed near a heat-generating unit board;   a plurality of carbon nanotubes (CNTs) attached to the member, wherein a coolant is propagated through the hole in the member so as to dissipate the heat generated by the heat-generating unit board; and   an air moving device for moving air across at least a portion of the heat-generating unit board and across at least a portion of the member.   
   
   
       20 . The cooling apparatus of  claim 19 , wherein the member is fluidly connected to a cooling device. 
   
   
       21 . The cooling apparatus of  claim 19 , further comprising a CNT heat exchanger module comprised of a porous material disposed about at least a portion of the member and the plurality of CNTs. 
   
   
       22 . A method of cooling air flow through an electrical system, comprising:
 disposing a cooling apparatus near a heat-generating unit board, wherein the cooling apparatus comprises at least a member with CNTs disposed on the member;   connecting the member to a cooling device;   moving air across the heat-generated unit board;   moving air across the member; and   moving coolant from the cooling device through the member so as to transfer heat generated by the heat-generating unit board.   
   
   
       23 . The method of cooling air flow through an electrical system of  claim 22 , further comprising:
 dissipating heat from the coolant with a cooling device fluidly connected to the member.