Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface Features

Abstract

An integrated circuit package is provided. The integrated circuit package includes a heat sink, a cured silicone thermally conductive adhesive material, and a surface. The adhesive material attaches the heat sink to the surface. The surface is a surface of at least one of a substrate, a surface of an integrated circuit die, or a surface of an encapsulating material of the integrated circuit package.

1 . An integrated circuit package, comprising:
 a heat sink;   a cured silicone thermally conductive adhesive material; and   a surface;   wherein the adhesive material attaches the heat sink to the surface;   wherein the surface is a surface of at least one of a substrate, a surface of an integrated circuit die, or a surface of an encapsulating material of the integrated circuit package.   
     
     
         2 . The integrated circuit package of  claim 1 , wherein the surface includes a surface of an encapsulating material, wherein the surface of the encapsulating material is curved. 
     
     
         3 . The integrated circuit package of  claim 1 , wherein the surface includes a surface of a substrate, wherein the surface of the substrate mounts and integrated circuit die and at least one component. 
     
     
         4 . The integrated circuit package of  claim 1 , wherein the thermally conductive adhesive material is a B-staged polymer. 
     
     
         5 . The integrated circuit package of  claim 1 , wherein the silicone thermally conductive adhesive material is TC100U. 
     
     
         6 . The integrated circuit package of  claim 1 , wherein the integrated circuit package is a ball grid array package. 
     
     
         7 . The integrated circuit package of  claim 1 , wherein the integrated circuit package is a pin grid array package. 
     
     
         8 . The integrated circuit package of  claim 1 , wherein the surface includes the surface of the substrate, wherein the adhesive material includes a depression formed therein. 
     
     
         9 . The integrated circuit package of  claim 8 , wherein the surface further comprises the surface of the integrated circuit die, wherein the depression is configured to accommodate the integrated circuit die. 
     
     
         10 . The integrated circuit package of  claim 8 , wherein a passive component is mounted to the surface of the substrate, wherein the surface comprises a surface of the passive component, and wherein the depression is configured to accommodate the passive component. 
     
     
         11 . The integrated circuit package of  claim 1 , wherein the adhesive material is a paste. 
     
     
         12 . The integrated circuit package of  claim 1 , wherein the surface is curved. 
     
     
         13 . The integrated circuit package of  claim 1 , wherein the surface comprises a surface of an integrated circuit exposed through the surface of the encapsulating material. 
     
     
         14 . The integrated circuit package of  claim 1 , wherein the adhesive material provides a thermal path between the heat sink and the integrated circuit package.