Lamination press pad

Abstract

A press pad for bonding substrates into a radio-frequency and/or intermediate-frequency module. The module has a plurality of channels, each of which has an adhesive film for bonding the substrate. The press pad has a pad body conformal to the substrate and pairs of lateral protrusions extending from central axes of opposing surfaces of the pad body. The protrusions are in the forms of semicircular bumps or fins extending perpendicular to the opposing surfaces. Therefore, the lateral extent of the press pad within the channel is minimized, such that the misalignment and inclination of the press pad is minimized. Further, the lateral protrusions are fabricated from material operative to resist lateral pressure, such that deformation of the press pad caused by lateral pressure is also prevented. Therefore, pressure gradient and pressure loss are prevented.

1 . A press pad for bonding a substrate into a case of a radio- and intermediate-frequency module, a radio-frequency module, or an intermediate frequency module, comprising:
 an elongate pad body having a cross section conformal to the substrate; and   a pair of protrusions extending from two opposing edges of the pad body.   
     
     
         2 . The press pad of  claim 1 , wherein the case includes a plurality of channels therein. 
     
     
         3 . The press pad of  claim 2 , wherein the press pad has a height higher than a depth of the channels. 
     
     
         4 . The press pad of  claim 2 , wherein the case comprising at least one adhesive film placed in the channels. 
     
     
         5 . The press pad of  claim 2 , wherein the protrusions provide line contact to sidewalls of the channels. 
     
     
         6 . The press pad of  claim 1 , wherein the protrusions include fins protruding from central axes of the opposing surfaces of the pad body. 
     
     
         7 . The press pad of  claim 1 , wherein the protrusions include semicircular bumps protruding from central axes of the opposing surfaces of the pad body. 
     
     
         8 . The press pad of  claim 1 , wherein the pad body is fabricated from polymer. 
     
     
         9 . The press pad of  claim 1 , wherein the pad body is fabricated from silicone. 
     
     
         10 . The press pad of  claim 1 , wherein the pad body and the protrusions are integrally formed. 
     
     
         11 . A lamination system for bonding substrates into a plurality of channels of a case, comprising:
 one or a plurality of adhesive films placed in the channels on a floor of the case;   a plurality of substrates to be bonded with the adhesive films within the channels;   a pressure source to provide an external pressure to interfaces between the substrates, the adhesive films, and the case floor;   at least one press pad to transfer the external pressure to the interfaces, wherein the press pad includes:
 a pad body having a cross section substantially conformal to the corresponding substrates; 
 a pair of protrusions laterally protruding from the pad body; and 
 a heat source for curing the adhesive films. 
   
     
     
         12 . The system of  claim 11 , wherein the pressure source includes a lamination source. 
     
     
         13 . The system of  claim 11 , wherein the pressure source includes a weight applied to a top surface of the press pad. 
     
     
         14 . The system of  claim 11 , wherein the pressure source includes a spring mechanism applied to a top surface of the press pad. 
     
     
         15 . The system of  claim 11 , wherein the protrusions have a semi-circular cross section. 
     
     
         16 . The system of  claim 11 , wherein the protrusions include fins extending perpendicular to the opposing surfaces of the pad body. 
     
     
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