US2010024481A1PendingUtilityA1
Method for Producing Layered Rings
Est. expiryAug 1, 2028(~2 yrs left)· nominal 20-yr term from priority
Inventors:Jeffrey D. Rothstein
A44C 9/00A44C 27/00Y10T29/49593
62
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Claims
Abstract
A ring formed of a first gold layer and second silver layer wherein the silver layer is more than fifty percent of the ring weight. The layers are bonded together with the gold layer on a portion of the outer surface to give an appearance of a ring formed entirely of gold. A method for fabricating the ring is also provided.
Claims
exact text as granted — not AI-modified1 . A layered jewelry ring comprising:
a. a first layer that encompasses a portion of the circumference on the outer surface of said ring; b. a second layer that encompasses substantially all of the circumference on the inner surface of said ring; c. a solder containing interface between said first layer and said second layer; whereby said first and second layer are bonded together to form a single fused assembly shaped into a ring.
2 . The ring of claim 1 wherein said first layer and said second layer are formed of the same material.
3 . The ring of claim 1 wherein said first layer and said second layer are formed of different materials.
4 . The ring of claim 1 wherein said first layer is formed of a metal, alloy, or combinations thereof.
5 . The ring of claim 1 wherein said first layer is formed of gold.
6 . The ring of claim 1 wherein said second layer is formed of a metal, alloy, or combinations thereof.
7 . The ring of claim 1 wherein said second layer is formed of silver.
8 . The ring of claim 1 wherein said first layer is about 0.05 to 0.50 cm thick.
9 . The ring of claim 1 wherein said second layer is about 0.65 to 0.75 cm thick.
10 . The ring of claim 1 wherein said second layer comprises more than fifty percent the weight of said ring.
11 . A layered ring comprising:
a. a first layer formed of gold or gold alloy, said first layer encompasses a portion of the outer circumference of said ring; b. a second layer formed of silver or silver alloy, said second layer encompasses substantially all of the inner circumference of said ring; c. a solder containing interface between said first layer and said second layer;
whereby said first and second layer are bonded together to form a single fused assembly shaped into a ring;
said ring formed such that said first layer is the primary visible layer when said ring is worn.
12 . A method for manufacturing a ring of claim 1 comprising the steps of:
(a) laminating a first plate to a desired thickness forming a first laminated plate; (b) laminating a second plate to a desired thickness forming a second laminated plate; (c) cutting a first blank from said first laminated plate; (d) cutting a second blank from said second laminated plate; (e) stamping a shelf on said second blank forming a stamped shelf; (f) soldering said first blank onto said second blank in an area defined by said stamped shelf, said soldered blanks collectively forming a soldered assembly; (g) passing said soldered assembly through an oven; (h) stamping said soldered assembly in a press and forming a bonded assembly with a fused edge; (i) cutting excess edge from said fused edge; (j) stamping a form onto said bonded assembly; (k) shaping said bonded assembly into a curved ring shape having two opposing ends; (l) cutting a joint on the ends of said curved bonded assembly; (m) soldering each of said ends one to another and forming a ring; and (n) polishing said ring.
13 . The method of claim 12 further comprising finishing said ring with desired designs, stone, stones, or combinations thereof.Join the waitlist — get patent alerts
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