Method of manufacturing printed circuit board

Abstract

A method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. The interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

1 . A method of manufacturing a printed circuit board, comprising:
 providing a resin substrate for the printed circuit board;   coating at least one surface of the resin substrate with fluorine resin;   forming at least one via hole for interlayer electrical connection in the substrate coated with the fluorine resin;   surface treating the substrate having the via hole using ion beams;   forming a copper seed layer on the surface treated substrate using a vacuum deposition process;   plating the substrate having the copper seed layer with a copper pattern to thus form a copper pattern plating layer; and   removing part of the copper seed layer on which the copper pattern plating layer is not formed.   
   
   
       2 . The method as set forth in  claim 1 , wherein the fluorine resin is selected from the group consisting of polytetrafluoroethylene, fluorinated ethylene propylene, perfluoroalkoxy, ethylene-tetrafluoroethylene, polyvinylidene fluoride, ethylene-chlorotrifluoroethylene, polychlorotrifluoroethylene, and combinations thereof. 
   
   
       3 . The method as set forth in  claim 1 , wherein the coating with the fluorine resin is performed by applying a liquid fluorine resin on the substrate and then heat treating it at 100˜450° C. 
   
   
       4 . The method as set forth in  claim 3 , wherein the applying of the fluorine resin and the heat treating thereof are repeated one to ten times. 
   
   
       5 . The method as set forth in  claim 1 , wherein the coating with the fluorine resin is performed in a sheet manner or a roll-to-roll manner. 
   
   
       6 . The method as set forth in  claim 1 , wherein the surface treating using the ion beams is performed in the presence of an inert gas selected from the group consisting of Ar, O 2 , N 2 , Xe, CF 4 , H 2 , Ne, Kr, and mixtures thereof. 
   
   
       7 . The method as set forth in  claim 1 , wherein the vacuum deposition process is sputtering, thermal evaporation, or e-beam. 
   
   
       8 . The method as set forth in  claim 1 , wherein the fluorine resin coating layer has a thickness from 20 nm to 10 μm. 
   
   
       9 . The method as set forth in  claim 1 , wherein the copper seed layer has a thickness from 20 nm to 4 μm. 
   
   
       10 . The method as set forth in  claim 1 , wherein the resin substrate is a substrate composed of epoxy resin or fluorine resin.