Surface mount package

Abstract

A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.

1 . A method for manufacturing a surface mount package, the method comprising:
 providing a first metal layer;   providing a second metal layer electrically connected to the first metal layer; and   providing a ceramic layer between the first and second metal layers, the ceramic layer having an opening therethrough and configured to electrically isolate a positive side from a negative side of the surface mount package.   
     
     
         2 . The method according to  claim 1 , further comprising:
 forming a gap within the first metal layer to electrically isolate the positive side from the negative side.   
     
     
         3 . The method according to  claim 1 , further comprising:
 providing an opening in both the second metal layer and ceramic layer configured to receive a surface mount device for mounting to the surface mount package.