Multidimensional Thermal Management Device for an Integrated Circuit Chip

Abstract

The present invention generally relates to a multidimensional thermal management device for an integrated circuit chip, and more particularly, to thermal management devices with a synthetic jet ejector adapted to operate along a hollow fin and a fin with cross-flow heat exchanger tubes. A thermal management device 50, a new circuit assembly 100 equipped with the new thermal management device 50, and a new guide for a synthetic jet ejector 20 for adapting the synthetic jet ejector technology to the new thermal management device 50 and associated circuit assembly 100 are disclosed.

1 . A thermal management device comprising: a heat exchanger with a cavity defined by an inner surface, and an external surface; and a fluid pumping device adapted to direct a plurality of jets over the inner surface. 
   
   
       2 . The thermal management device of  claim 1 , wherein the cavity is a fin and the fluid pumping device is a synthetic jet ejector. 
   
   
       3 . The thermal management device of  claim 2 , further comprising a mover adapted to direct a flow over the cavity. 
   
   
       4 . The thermal management device of  claim 2 , wherein the fin comprises a plurality of cross-flow heat exchanger tubes. 
   
   
       5 . The thermal management device of  claim 4 , wherein the tubes are staggered along rows and columns over the surface of the fin. 
   
   
       6 . The thermal management device of  claim 4 , wherein the heat exchanger comprises a plurality of radially extending fins. 
   
   
       7 . The thermal management device of  claim 6 , wherein the tubes are staggered between two successive fins. 
   
   
       8 . The thermal management device of  claim 2 , wherein the heat exchanger comprises a heat distribution core thermally connected to the fin. 
   
   
       9 . The thermal management device of  claim 6 , wherein the heat exchanger comprises a heat distribution core and wherein each of the plurality of fins are connected to the core. 
   
   
       10 . The thermal management device of  claim 8 , wherein the heat distribution core is also thermally connected to a heat generating element and includes a transfer agent selected from the group consisting of: a layer of nanowires, and a multi-layer foil. 
   
   
       11 . The thermal management device of  claim 8 , wherein the heat distribution core is also thermally connected to a heat generating element and includes a thermal interface and a thermal interface material selected from the group consisting of: a grease, a paste, a solid, or a liquid. 
   
   
       12 . The thermal management device of  claim 11 , wherein the thermal interface includes at least one patterned surface with grooves in contact with the thermal interface material. 
   
   
       13 . A circuit assembly comprising:
 a circuit substrate;   a heat generating component adapted to the circuit substrate; and   a thermal management including a heat exchanger with a hollow fin defined by an inner surface, and an external surface, and a synthetic jet ejector adapted to direct a plurality of synthetic jets over the inner surface.   
   
   
       14 . The circuit assembly of  claim 13 , wherein the fin comprises a plurality of cross-flow heat exchanger tubes across the hollow fin. 
   
   
       15 . A guide for a synthetic jet ejector with a plurality of synthetic jets along a first orientation, comprising: a guide plate with a plurality of passages each connected to an entry port and an exit port, the entry port adapted to receive a jet of a synthetic jet ejector along the first orientation, and the exit port adapted to release the jet of the synthetic jet ejector in a second orientation. 
   
   
       16 . The guide for a synthetic jet ejector of  claim 15 , wherein the second orientation is perpendicular to the first orientation. 
   
   
       17 . The guide for a synthetic jet ejector of  claim 16 , wherein the plurality of exit ports are arranged on the guide for adaptation with an inside surface of a hollow fin of a heat exchanger defined by the inner surface, and an external surface.