Stacked-type semiconductor device package

Abstract

A stacked-type semiconductor device package is provided. The stacked-type semiconductor device package includes a plurality of stacked semiconductor chip packages with joining electrodes exposed on sides of the semiconductor chip packages and a flexible printed circuit board (flexible PCB) on which the stacked semiconductor chip packages are mounted. The flexible PCB includes a first surface having connecting electrodes corresponding to the joining electrodes of the stacked semiconductor chip packages and a second surface opposite the first surface. The flexible PCB covers the sides of the stacked semiconductor chip packages, and the connecting electrodes of the first surface are connected to the joining electrodes of the stacked semiconductor chip packages.

1 . A stacked-type semiconductor device package, comprising:
 a plurality of stacked semiconductor chip packages with joining electrodes exposed on sides of the semiconductor chip packages; and   a flexible printed circuit board (PCB) on which the stacked semiconductor chip packages are mounted, the flexible PCB including a first surface having connecting electrodes corresponding to the joining electrodes of the stacked semiconductor chip packages and a second surface opposite the first surface,   wherein the flexible PCB covers the sides of the stacked semiconductor chip packages, and the connecting electrodes of the first surface are connected to the joining electrodes of the stacked semiconductor chip packages.   
   
   
       2 . The stacked-type semiconductor device package of  claim 1 , wherein the stacked semiconductor chip packages have the same structure and size. 
   
   
       3 . The stacked-type semiconductor device package of  claim 1 , wherein the stacked semiconductor chip packages have different structures and sizes with respect to each other. 
   
   
       4 . The stacked-type semiconductor device package of  claim 1 , wherein the flexible PCB has a tape type or a film type. 
   
   
       5 . The stacked-type semiconductor device package of  claim 1 , further comprising:
 a molding material configured to seal the stacked semiconductor chip packages, the joining electrodes, and the first surface of the flexible PCB.   
   
   
       6 . The stacked-type semiconductor device package of  claim 5 , wherein the molding material includes epoxy molding compound. 
   
   
       7 . The stacked-type semiconductor device package of  claim 1 , further comprising:
 solder balls disposed on the second surface of the flexible PCB.   
   
   
       8 . The stacked-type semiconductor device package of  claim 1 , further comprising pre-solders disposed on the connecting electrodes. 
   
   
       9 . The stacked-type semiconductor device package of  claim 1 , wherein the flexible PCB covers at least a portion of a top surface of at least one of the stacked semiconductor chip packages. 
   
   
       10 . The stacked-type semiconductor device package of  claim 1 , further comprising:
 a first adhesive material adhering a first one of the stacked semiconductor chip packages to the first surface of the flexible PCB; and   a second adhesive material adhering the plurality of stacked semiconductor chip packages to each other.